Taiwan Tech Weekly: TSMC's Capacity Crunch; Latest Intel on Leading Edge Yield

Smartkarma

01/10

⬆ TSMC (Taiwan Semiconductor Manufacturing) - ADR - TSMC faces challenges balancing wafer production and packaging, but remains optimistic about future growth and capacity. Taiwan Dual-Listings show potential opportunities for ASE and ChipMOS.

Continue reading on Smartkarma:- https://www.smartkarma.com/insights/taiwan-tech-weekly-tsmc-s-capacity-crunch-latest-intel-on-leading-edge-yield?utm_source=tiger_community

By Vincent Fernando, CFA, Insight Provider on Smartkarma:- https://www.smartkarma.com/profiles/vincent-fernando-cfa-f29d1c28-fc02-4296-afcd-5e900f012d86?utm_source=tiger_community

On TSMC (Taiwan Semiconductor Manufacturing) - ADR (TSM):- https://www.smartkarma.com/entities/taiwan-semiconductor-manufacturing-adr?utm_source=tiger_community

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Taiwan Dual-Listings show potential opportunities for ASE and ChipMOS.</p><br/><p>Continue reading on Smartkarma:- https://www.smartkarma.com/insights/taiwan-tech-weekly-tsmc-s-capacity-crunch-latest-intel-on-leading-edge-yield?utm_source=tiger_community</p><p>By Vincent Fernando, CFA, Insight Provider on Smartkarma:- https://www.smartkarma.com/profiles/vincent-fernando-cfa-f29d1c28-fc02-4296-afcd-5e900f012d86?utm_source=tiger_community</p><p>On TSMC (Taiwan Semiconductor Manufacturing) - ADR (TSM):- https://www.smartkarma.com/entities/taiwan-semiconductor-manufacturing-adr?utm_source=tiger_community</p></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Taiwan Tech Weekly: TSMC's Capacity Crunch; Latest Intel on Leading Edge Yield</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nTaiwan Tech Weekly: TSMC's Capacity Crunch; Latest Intel on Leading Edge Yield\n</h2>\n<h4 class=\"meta\">\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1009381084\">\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/bb92df7ff435380d798b36afa44a5c07);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Smartkarma </p>\n<p class=\"h-time smaller\">2026-01-10 15:27</p>\n</div>\n</a>\n</h4>\n</header>\n<article>\n<html><body><img src=\"https://static-prod.smartkarma.com/insight_cover_images/63374275-da7c-40e7-afa1-0b8e90c0470e.png\"/>\n<p>⬆  <a href=\"https://laohu8.com/S/TSM\">TSMC (Taiwan Semiconductor Manufacturing) - ADR</a> - TSMC faces challenges balancing wafer production and packaging, but remains optimistic about future growth and capacity. Taiwan Dual-Listings show potential opportunities for ASE and ChipMOS.</p><br/><p>Continue reading on Smartkarma:- https://www.smartkarma.com/insights/taiwan-tech-weekly-tsmc-s-capacity-crunch-latest-intel-on-leading-edge-yield?utm_source=tiger_community</p><p>By Vincent Fernando, CFA, Insight Provider on Smartkarma:- https://www.smartkarma.com/profiles/vincent-fernando-cfa-f29d1c28-fc02-4296-afcd-5e900f012d86?utm_source=tiger_community</p><p>On TSMC (Taiwan Semiconductor Manufacturing) - ADR (TSM):- https://www.smartkarma.com/entities/taiwan-semiconductor-manufacturing-adr?utm_source=tiger_community</p></body></html>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"BK4575","symbol_name":"芯片概念","start_time":0,"source_url":"https://www.smartkarma.com/home/private-investor-solutions/","article_id":"2602538589","we_media_id":"1009381084","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2602538589","pubTimestamp":1768030076,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Smartkarma","introduction":"Smartkarma","home_visible":1,"id":"1009381084","head_image":"https://static.tigerbbs.com/bb92df7ff435380d798b36afa44a5c07"},"summary":"utm_source=tiger_community","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"BK4575":"芯片概念","LU2041044095.USD":"Blackrock Circular Economy A2 USD","IE00BFXG0V08.USD":"BNY MELLON GLOBAL LEADERS \"B\" (USD) ACC","LU1211504680.USD":"ALLIANZ HIGH DIVIDEND ASIA PACIFIC EQUITY \"AM\" (USD) INC","SGXZ99366536.SGD":"United Global Innovation A Acc SGD-H","IE00BHPRN162.USD":"BNY MELLON BLOCKCHAIN INNOVATION \"B\" (USD) ACC","LU0889565833.HKD":"FRANKLIN TECHNOLOGY \"A\" (HKD) ACC","LU2106854487.HKD":"ALLIANZ THEMATICA \"AMG\" (HKD) INC","BK4612":"AI芯片","LU1282649067.USD":"ALLIANZ ASIAN MULTI INCOME PLUS \"AMG\" (USD) INC A","LU0689626769.HKD":"AB SICAV I - 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ADR - TSMC faces challenges balancing wafer production and packaging, but remains optimistic about future growth and capacity. Taiwan Dual-Listings show potential opportunities for ASE and ChipMOS.Continue reading on Smartkarma:- https://www.smartkarma.com/insights/taiwan-tech-weekly-tsmc-s-capacity-crunch-latest-intel-on-leading-edge-yield?utm_source=tiger_communityBy Vincent Fernando, CFA, Insight Provider on Smartkarma:- https://www.smartkarma.com/profiles/vincent-fernando-cfa-f29d1c28-fc02-4296-afcd-5e900f012d86?utm_source=tiger_communityOn TSMC (Taiwan Semiconductor Manufacturing) - ADR (TSM):- https://www.smartkarma.com/entities/taiwan-semiconductor-manufacturing-adr?utm_source=tiger_community","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}