Samsung Seen Regaining Competitiveness in HBM Market -- Market Talk

Dow Jones

01/30

0507 GMT - Samsung Electronics is seen regaining competitiveness in the premium high-bandwidth memory chip market, Daiwa Capital's S.K. Kim and Daekoon Kim write in a note. The Daiwa analysts point to Samsung management's latest guidance at Thursday's earnings call that the company's HBM4 products--the industry's most advanced dynamic random-access memory used in artificial-intelligence accelerators--are in the final stage of qualification with a major customer. They also note that Samsung plans to ship HBM4 products in the current quarter, likely February, and is considering adopting a hybrid-bonding technology for its 16H HBM4E products. Daiwa raises its 2026-2027 EPS forecasts for Samsung by 31%-64%. (kwanwoo.jun@wsj.com)

(END) Dow Jones Newswires

January 30, 2026 00:07 ET (05:07 GMT)

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Kim and Daekoon Kim write in a note. The Daiwa analysts point to Samsung management's latest guidance at Thursday's earnings call that the company's HBM4 products--the industry's most advanced dynamic random-access memory used in artificial-intelligence accelerators--are in the final stage of qualification with a major customer. They also note that Samsung plans to ship HBM4 products in the current quarter, likely February, and is considering adopting a hybrid-bonding technology for its 16H HBM4E products. Daiwa raises its 2026-2027 EPS forecasts for Samsung by 31%-64%. 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Kim and Daekoon Kim write in a note. The Daiwa analysts point to Samsung management's latest guidance at Thursday's earnings call that the company's HBM4 products--the industry's most advanced dynamic random-access memory used in artificial-intelligence accelerators--are in the final stage of qualification with a major customer. They also note that Samsung plans to ship HBM4 products in the current quarter, likely February, and is considering adopting a hybrid-bonding technology for its 16H HBM4E products. Daiwa raises its 2026-2027 EPS forecasts for Samsung by 31%-64%. (kwanwoo.jun@wsj.com) \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  (END) Dow Jones Newswires\n</p>\n<p>\n  January 30, 2026 00:07 ET (05:07 GMT)\n</p>\n<p>\n  Copyright (c) 2026 Dow Jones &amp; Company, Inc.\n</p>\n</font>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"SSNHZ","symbol_name":"Samsung Electronics Co., Ltd.","start_time":0,"source_url":"https://dowjonesnews.com/newdjn/logon.aspx?AL=N","article_id":"2607606078","we_media_id":"106","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2607606078","pubTimestamp":1769749620,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Dow Jones","introduction":"Dow Jones publishes the world’s most trusted business news and financial information in a variety of media.","home_visible":0,"id":"106","head_image":"https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99"},"summary":"0507 GMT - Samsung Electronics is seen regaining competitiveness in the premium high-bandwidth memory chip market, Daiwa Capital's S.K. Kim and Daekoon Kim write in a note. The Daiwa analysts point to Samsung management's latest guidance at Thursday's earnings call that the company's HBM4 products--the industry's most advanced dynamic random-access memory used in artificial-intelligence accelerators--are in the final stage of qualification with a major customer. They also note that Samsung plans to ship HBM4 products in the current quarter, likely February, and is considering adopting a hybrid-bonding technology for its 16H HBM4E products. Daiwa raises its 2026-2027 EPS forecasts for Samsung by 31%-64%. ","collect":0,"end_time":0,"defaultTopTitle":"","property":[],"viewcount":null,"language":"en","relate_stocks":{"SSNHZ":"Samsung Electronics Co., Ltd."},"translate_title":"三星在HBM市场重新获得竞争力——Market Talk","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"SSNHZ":0.9},"content_text":"0507 GMT - Samsung Electronics is seen regaining competitiveness in the premium high-bandwidth memory chip market, Daiwa Capital's S.K. Kim and Daekoon Kim write in a note. The Daiwa analysts point to Samsung management's latest guidance at Thursday's earnings call that the company's HBM4 products--the industry's most advanced dynamic random-access memory used in artificial-intelligence accelerators--are in the final stage of qualification with a major customer. They also note that Samsung plans to ship HBM4 products in the current quarter, likely February, and is considering adopting a hybrid-bonding technology for its 16H HBM4E products. Daiwa raises its 2026-2027 EPS forecasts for Samsung by 31%-64%. (kwanwoo.jun@wsj.com) \n\n\n \n\n\n  (END) Dow Jones Newswires\n\n\n  January 30, 2026 00:07 ET (05:07 GMT)\n\n\n  Copyright (c) 2026 Dow Jones & Company, Inc.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":true,"code":"91000000","status":"200"}}}