思科發布全新人工智能網路芯片，挑戰博通和Nvidia

路透中文

02/10

<a href="https://laohu8.com/S/CSCO">思科</a>發布全新人工智能網路芯片，挑戰<a href="https://laohu8.com/S/AVGO">博通</a>和<a href="https://laohu8.com/S/NVDA">Nvidia</a>

路透舊金山2月10日 - 思科CSCO.O周二發布了一款新型芯片和路由器，旨在加快大型數據中心的資訊傳輸速度，該產品將與博通 AVGO.O和Nvidia(輝達/英偉達)NVDA.O的產品競爭，以期在價值6,000億美元的人工智能$(AI)$基礎建設支出熱潮中分得一杯羹。

思科表示，其 Silicon One G300 交換器芯片預計在今年下半年上市，將能讓負責訓練與運行 AI 系統的芯片，透過數十萬條連結彼此溝通。

思科通用硬件集團執行副總裁Martin Lund在接受路透採訪時表示，該芯片將採用台積電2330.TW的3納米芯片製程製造，並將具有幾個新的「減震器」功能，旨在當AI芯片網路遭遇大量數據流量突增時，避免處理速度被拉低。

思科預計，該芯片能讓部分 AI 運算工作加快 28%，部分原因是它能在微秒內自動將資料重新導向，繞過網路中的任何問題。(完)

(編審戴素萍)

((emmy.tai@thomsonreuters.com; +886-2-87295112;))

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</span>思科<span>CSCO.O</span>周二發布了一款新型芯片和路由器，旨在加快大型數據中心的資訊傳輸速度，該產品將與<a href=\"https://laohu8.com/S/600455\">博通</a> <span>AVGO.O</span>和Nvidia(輝達/英偉達)<span>NVDA.O</span>的產品競爭，以期在價值6,000億美元的<span></span>人工智能<a href=\"https://laohu8.com/S/AI\">$(AI)$</a>基礎建設支出熱潮中分得一杯羹。</p><p>思科表示，其 Silicon One G300 交換器芯片預計在今年下半年上市，將能讓負責訓練與運行 AI 系統的芯片，透過數十萬條連結彼此溝通。</p><p>思科通用硬件集團執行副總裁Martin Lund在接受路透採訪時表示，該芯片將採用<a href=\"https://laohu8.com/S/TSM\">台積電</a><span>2330.TW</span>的3納米芯片製程製造，並將具有幾個新的「減震器」功能，旨在當AI芯片網路遭遇大量數據流量突增時，避免處理速度被拉低。</p><p>思科預計，該芯片能讓部分 AI 運算工作加快 28%，部分原因是它能在微秒內自動將資料重新導向，繞過網路中的任何問題。(完)</p><p> (編審 戴素萍)</p><p> ((emmy.tai@thomsonreuters.com; +886-2-87295112;))</p></body></html>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>思科發布全新人工智能網路芯片，挑戰博通和Nvidia</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 12.5px; color: #7E829C; margin: 0;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\n思科發布全新人工智能網路芯片，挑戰博通和Nvidia\n</h2>\n<h4 class=\"meta\">\n<a class=\"head\" href=\"https://laohu8.com/wemedia/1098195322\">\n\n<div class=\"h-thumb\" style=\"background-image:url(https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">路透中文 </p>\n<p class=\"h-time smaller\">2026-02-10 16:38</p>\n</div>\n</a>\n</h4>\n</header>\n<article>\n<html xmlns=\"http://www.w3.org/1999/xhtml\"><head><title><a href=\"https://laohu8.com/S/CSCO\">思科</a>發布全新人工智能網路芯片，挑戰<a href=\"https://laohu8.com/S/AVGO\">博通</a>和<a href=\"https://laohu8.com/S/NVDA\">Nvidia</a></title></head><body><p>\n<span>路透舊金山2月10日</span><span> - </span>思科<span>CSCO.O</span>周二發布了一款新型芯片和路由器，旨在加快大型數據中心的資訊傳輸速度，該產品將與<a href=\"https://laohu8.com/S/600455\">博通</a> <span>AVGO.O</span>和Nvidia(輝達/英偉達)<span>NVDA.O</span>的產品競爭，以期在價值6,000億美元的<span></span>人工智能<a href=\"https://laohu8.com/S/AI\">$(AI)$</a>基礎建設支出熱潮中分得一杯羹。</p><p>思科表示，其 Silicon One G300 交換器芯片預計在今年下半年上市，將能讓負責訓練與運行 AI 系統的芯片，透過數十萬條連結彼此溝通。</p><p>思科通用硬件集團執行副總裁Martin Lund在接受路透採訪時表示，該芯片將採用<a href=\"https://laohu8.com/S/TSM\">台積電</a><span>2330.TW</span>的3納米芯片製程製造，並將具有幾個新的「減震器」功能，旨在當AI芯片網路遭遇大量數據流量突增時，避免處理速度被拉低。</p><p>思科預計，該芯片能讓部分 AI 運算工作加快 28%，部分原因是它能在微秒內自動將資料重新導向，繞過網路中的任何問題。(完)</p><p> (編審 戴素萍)</p><p> ((emmy.tai@thomsonreuters.com; +886-2-87295112;))</p></body></html>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU1032955483.USD","symbol_name":"NORDEA 1 STABLE RETURN \"HB\" (USDHDG) ACC","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20260210:nL6S3Z606E:1","article_id":"2610617850","we_media_id":"1098195322","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2610617850","pubTimestamp":1770712739,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"路透中文","introduction":"路透中文","home_visible":1,"id":"1098195322","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"路透舊金山2月10日 - 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思科CSCO.O周二發布了一款新型芯片和路由器，旨在加快大型數據中心的資訊傳輸速度，該產品將與博通 AVGO.O和Nvidia(輝達/英偉達)NVDA.O的產品競爭，以期在價值6,000億美元的人工智能$(AI)$基礎建設支出熱潮中分得一杯羹。思科表示，其 Silicon One G300 交換器芯片預計在今年下半年上市，將能讓負責訓練與運行 AI 系統的芯片，透過數十萬條連結彼此溝通。思科通用硬件集團執行副總裁Martin Lund在接受路透採訪時表示，該芯片將採用台積電2330.TW的3納米芯片製程製造，並將具有幾個新的「減震器」功能，旨在當AI芯片網路遭遇大量數據流量突增時，避免處理速度被拉低。思科預計，該芯片能讓部分 AI 運算工作加快 28%，部分原因是它能在微秒內自動將資料重新導向，繞過網路中的任何問題。(完) (編審 戴素萍) ((emmy.tai@thomsonreuters.com; +886-2-87295112;))","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":true,"code":"91000000","status":"200"}}}