BRIEF-US Chip Firm KLA Signed MoU With India's Tamil Nadu Govt To Invest $400 Mln To Establish Global R&D Campus- Tamil Nadu Industries Minister

Reuters
02/13
BRIEF-US Chip Firm <a href="https://laohu8.com/S/KLAC">KLA</a> Signed MoU With India's Tamil Nadu Govt To Invest $400 Mln To Establish Global R&D Campus- Tamil Nadu Industries Minister

Feb 13 (Reuters) -

  • U.S. CHIP FIRM KLA SIGNED MOU WITH INDIA'S TAMIL NADU GOVERNMENT TO INVEST $400 MILLION TO ESTABLISH GLOBAL RESEARCH AND DEVELOPMENT CAMPUS- TAMIL NADU INDUSTRIES MINISTER

Further company coverage: KLAC.O

((Reuters.Briefs@thomsonreuters.com;))

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