DesignCon 2026: 448G Serdes 依然還不是現實

光纖在線

03/04

3/04/2026，光纖在線訊，DesignCon 2026（美國聖克拉拉，2月24–26日）上編輯最關心的話題就是448G SerDes技術進展到底如何？去年的Designcon，448G沒有如約，今年呢？雖然沒能到現場，我通過AI整理了各廠商在448G SerDes技術上的佈局與突破。本次大會中，芯片/IP、互連硬件、測試測量、EDA等領域頭部廠商紛紛亮出448G SerDes相關成果，覆蓋...

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href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260304131917a6a096b0&s=b\">網頁鏈接</a>\n\n</div>\n\n<div class=\"bt-text\">\n\n\n<p> 來源：<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260304131917a6a096b0&s=b\">光纖在線</a></p>\n<p>為提升您的閱讀體驗，我們對本頁面進行了排版優化</p>\n\n\n</div>\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0390134368.USD","symbol_name":"FRANKLIN GLOBAL GROWTH \"A\" (USD) ACC","start_time":0,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260304131917a6a096b0&s=b","article_id":"2616583297","we_media_id":null,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20260304131917a6a096b0&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description 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6交換機可實現單GPU雙向帶寬3.6TB/s，72顆GPU集群總帶寬達260TB/s，依託448G技術支撐大規模AI集群算力調度，推動448G在高端AI場景的規模化應用。- 芯和半導體（國產）：推出XAI多智能體EDA平台，可實現448G鏈路仿真與全鏈路協同設計，助力國產芯片與互連方案的研發落地，填補國產EDA在448G領域的協同設計空白。（二）互連硬件廠商：銅互連為主流，成套方案密集發布共封裝銅（CPC）成為448G SerDes短距（<1m）傳輸的主流架構，各互連廠商聚焦銅互連方案，推出線纜、連接器、端到端解決方案，驗證448G銅互連的可行性與可靠性。- 立訊技術（Luxshare）：發布448G KOOLIO™ CPC to OSFP Airchannel™端到端方案，支持>90GHz帶寬，兼容多模式448G傳輸，完成銅纜在448G場景的適用性驗證，其負責人明確表示，在448G速率下銅連接仍將是主流，打破業界對銅連接無法支撐該速率的認知，同時公司448G產品已與多家客户展開預研工作。- 鴻騰精密（Foxconn）：聯合安立（Anritsu）推出448G Twinax線纜，採用125GHz VNA完成高精度信號完整性表徵，保障線纜傳輸可靠性，為448G高速傳輸提供穩定的線纜支撐。- Samtec：展示Si-Fly HD CPC連接器，可兼容224G/448G共封裝銅互連，同步推出Bulls Eye BE130測試組件，支持448G差分信號測試，實現448G互連硬件與測試的協同配套。- Molex、TE Connectivity、Amphenol：均發布448G背板、板對板、OSFP全套互連方案，明確支持向1.6T速率平滑升級，適配AI數據中心高密度互連需求，其中安費諾等企業已與沃爾核材等供應商達成合作，推進448G相關產品落地。- 沃爾核材（國產）：已完成下一代單通道448G高速通信線樣品的開發工作，已交給重點客户驗證中，其224G產品已實現高端市場突破，為448G產品量產積累了技術與客户基礎。（三）測試測量廠商：全鏈路方案成熟，護航量產落地448G SerDes高速傳輸對測試驗證提出更高要求，頭部測試廠商推出全鏈路測試方案，解決高速信號測試難題，成為448G量產的「最後防線」。- 是德科技（Keysight）、安立（Anritsu）、泰克（Tektronix）/Teledyne LeCroy：推出448G PAM4全鏈路測試方案，覆蓋發射機SNDR、RLM、信道S參數、誤碼率等核心指標，支持自動化多端口矩陣測試；其中安立聯合鴻騰精密完成448G Twinax線纜的信號完整性表徵，進一步完善448G測試體系。- 核心設備升級：示波器與VNA（矢量網絡分析儀）均覆蓋125GHz+，可滿足448G信號的完整表徵，解決高速信號測試難度大的痛點，為448G技術的研發與量產提供可靠的測試支撐。（四）封裝與材料廠商：適配高速需求，提供核心支撐448G SerDes對封裝與材料的低損耗、低粗糙度要求大幅提升，相關廠商圍繞核心需求推出適配方案：- 封裝架構：共封裝銅（CPC）成為芯片-封裝-連接器的主流架構，可縮短信號路徑、降低傳輸損耗，東莞市「輕有源」創新聯合體也發布相關解決方案，推動448G高速銅互連技術演進。- 材料升級：VLP/ULP超低輪廓銅箔（亞微米級粗糙度）、低Dk/Df高速板材得到廣泛應用，有效保障56GHz+高頻信號的完整性，解決高速傳輸中的信號衰減問題，為448G高速傳輸提供材料支撐。（五）PAM6 技術成為重要趨勢在AMD工程師主導的一場教程中，專家們提出了一個務實的觀點：要想實現448Gbps，不能幻想PAM4的簡單升級，而必須重新權衡設計。他們將PAM6定位為介於PAM4與PAM8之間的「中間路徑」——相比PAM4，它提升了頻譜效率；相比PAM8，它又沒有過快地犧牲噪聲容限。與會者普遍認識到，448G不僅僅是調製方式的挑戰，更是**系統協同設計**的考驗：模擬前端、均衡算法、編碼以及前向糾錯技術必須齊頭並進。如何看待本次DesignCon上的448G 技術進展？AI給出的分析是：AI面臨的三大核心挑戰，需全產業鏈協同解決：- 信號完整性挑戰：90GHz+帶寬下，串擾、抖動、均衡複雜度急劇提升，對全鏈路協同設計、材料性能、封裝工藝的要求大幅提高，成為448G量產的核心技術瓶頸。- 功耗控制挑戰：448G SerDes單通道功耗較224G增加約50%，液冷散熱與48V電源架構已成為448G系統的標配，如何平衡功耗與散熱、成本，是廠商需要重點解決的問題。- 標準化與成本挑戰：目前448G相關部分規範仍在完善中（如PCIe 8.0），同時高速材料、封裝工藝的升級導致成本上升，如何推動技術標準化、降低量產成本，是實現448G規模化應用的關鍵。綜上，448G技術依然是各大連接器，芯片，架構廠商發展的重點，只是這個技術的難度超過了包括編輯在內許多人的預期。技術的發展並不能簡單的翻倍。448G SerDes受限，連帶3.2T光模塊技術發展一定受限，我們OFC再看。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}