Celestica, AMD Partner on New Hardware Platform to Power AI Models

Dow Jones

03/16

By Adriano Marchese

Celestica is partnering with chip giant AMD to build new large-scale hardware to power artificial intelligence systems.

As part of the collaboration, Celestica, a hardware manufacturer, will design and manufacture the high-speed switches that will connect AMD's next generation of AI chips when the Helios rack-scale AI architecture launches in 2026.

A rack-scale AI platform is a prebuilt, room-sized computer system designed to run large AI models.

The two companies plan to make the Helios system available to cloud providers, businesses and research groups, aiming accelerate the pace of setting up large-scale AI hardware, they said Monday.

Write to Adriano Marchese at adriano.marchese@wsj.com

(END) Dow Jones Newswires

March 16, 2026 08:45 ET (12:45 GMT)

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system available to cloud providers, businesses and research groups, aiming accelerate the pace of setting up large-scale AI hardware, they said Monday. \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  Write to Adriano Marchese at adriano.marchese@wsj.com \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  (END) Dow Jones Newswires\n</p>\n<p>\n  March 16, 2026 08:45 ET (12:45 GMT)\n</p>\n<p>\n  Copyright (c) 2026 Dow Jones &amp; Company, Inc.\n</p>\n</font>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Celestica, AMD Partner on New Hardware Platform to Power AI Models</title>\n<style 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style=\"white-space: pre\">\n \n</pre>\n<p>\n  By Adriano Marchese \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  Celestica is partnering with chip giant <a href=\"https://laohu8.com/S/AMD\">AMD</a> to build new large-scale hardware to power artificial intelligence systems. \n</p>\n<p>\n  As part of the collaboration, Celestica, a hardware manufacturer, will design and manufacture the high-speed switches that will connect AMD's next generation of AI chips when the Helios rack-scale AI architecture launches in 2026. \n</p>\n<p>\n  A rack-scale AI platform is a prebuilt, room-sized computer system designed to run large AI models. \n</p>\n<p>\n  The two companies plan to make the Helios system available to cloud providers, businesses and research groups, aiming accelerate the pace of setting up large-scale AI hardware, they said Monday. \n</p>\n<pre style=\"white-space: pre\">\n \n</pre>\n<p>\n  Write to Adriano Marchese at adriano.marchese@wsj.com \n</p>\n<pre 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models. \n\n\n  The two companies plan to make the Helios system available to cloud providers, businesses and research groups, aiming accelerate the pace of setting up large-scale AI hardware, they said Monday. \n\n\n \n\n\n  Write to Adriano Marchese at adriano.marchese@wsj.com \n\n\n \n\n\n  (END) Dow Jones Newswires\n\n\n  March 16, 2026 08:45 ET (12:45 GMT)\n\n\n  Copyright (c) 2026 Dow Jones & Company, Inc.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"corporation","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":true,"code":"91000000","status":"200"}}}