Honda Motor (TYO:7267) filed for the listing of 2.50 billion euros worth of bonds on the Singapore bourse, according to a filing with the Singapore Exchange on Tuesday.
The automotive company filed for 750 million euros worth of 4.008% bonds due 2032. 500 million euros worth of 4.443% bonds due 2036 and 1.25 billion euros worth of 3.501% bonds due 2029.
The bonds will be listed and quoted on the Bonds Market on July 8, the company said.