Hanmi Semiconductor (KRX:042700) is planning new product launches and U.S. expansion as it looks to strengthen its position in the AI and High Bandwidth Memory, or HBM, semiconductor markets.

The semiconductor company aims to release a second-generation hybrid bonder prototype by year-end, with factory operations slated for early 2027, according to a bourse filing on Monday.

Simultaneously, Hanmi is pursuing the establishment of a U.S. subsidiary in the second half of the year to enter the American AI semiconductor market, including terafab facilities.

In terms of specific new products, Hanimi plans to launch the BOC COB Bonder for stacked memory, the 2.5D Thermal Compression (TC) Bonder for AI system semiconductors, and a Wide TC Bonder.

Hanmi has also doubled its corporate governance compliance rate year-over-year and conducted tax-free dividends for fiscal 2025, achieving an 11.1% growth in total dividends and a 35.5% payout ratio.