Tech, Media & Telecom Roundup: Market Talk

Dow Jones
08/03

The latest Market Talks covering Technology, Media and Telecom. Published exclusively on Dow Jones Newswires at 4:20 ET, 12:20 ET and 16:50 ET.

0636 GMT - Taiwan's tech earnings so far confirm that AI infrastructure investment remains in the early stages of a multi-year expansion, Citi analysts say in a research note. Companies in the semiconductor supply chain, including TSMC, UMC and MediaTek, have raised guidance, increased capital expenditure or expressed improving visibility into 2027 AI demand. "Despite recent market turbulence, companies reaffirmed that AI investment cycle is broadening across the entire hardware ecosystem," they say. The AI beneficiaries will increasingly extend beyond computing to networking and power, they add. AI data center products will be supported by strong demand for high-efficiency power supplies, power distribution, liquid cooling and higher rack power density, they add, making Delta Electronics one of the key beneficiaries. (sherry.qin@wsj.com)

0231 GMT - Share prices of Chinese suppliers in the smartphone sector hinge on their 2Q results and 2H outlooks, Citi analysts say in a research note. Apple's latest earnings call suggests that supply constraints will increase significantly with limited supply-chain flexibility in the September quarter, they note. While memory costs are likely continue to increase in 3Q, costs on certain non-memory components could fall, they say. Some 1H results of Chinese smartphone supply-chain companies could be "better-than-feared amid inventory build" ahead of the supply constraints, while pressure will likely increase in 2H, they add. (sherry.qin@wsj.com)

0157 GMT - Malaysia's artificial-intelligence exposure is expected to broaden, with more companies participating across different layers of the AI infrastructure supply chain, CIMB Securities analyst Mohd Shanaz Noor Azam says in a note. He expects AI monetization to expand beyond chip manufacturing into inspection equipment, advanced packaging materials, silicon intellectual property, and silicon photonics. He also sees silicon photonics emerging as a key growth driver as expanding AI clusters drive demand for faster optical interconnects. He expects government support and industry collaboration to strengthen Malaysia's integrated-circuit design and advanced packaging capabilities, supporting higher value creation. CIMB maintains an overweight rating on Malaysia's tech sector, naming Vitrox and Malaysian Pacific Industries as its preferred picks.

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