Market Chatter: TSMC Plans New Advanced Packaging Hub in Kaohsiung Industrial Park, Taiwan

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Taiwan Semiconductor Manufacturing Co (TPE:2330) plans to expand its presence at the Baipu Industrial Park in Kaohsiung, Taiwan, by developing a three-hectare site featuring two buildings with modular facilities, a Focus Taiwan report said on Wednesday, quoting the company's vice president of advanced packaging technology and service, Jun He.

The company plans to set up small cleanrooms and laboratories for testing and joint development involving advanced packaging technologies, equipment and materials, as part of the proposed new unit, the report said.

The site will also act as a training center for high-level semiconductor process and equipment specialists, according to the report.

The chipmaker is working with the Ministry of Economic Affairs and the Kaohsiung City government for the expansion, which is expected to improve the validation efficiency of semiconductor materials and equipment by 25-50%, He said.

(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)

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