0745 GMT - Samsung Electronics' rapid expansion of high-bandwidth memory production could squeeze supplies of other general-purpose memory chips, KB Securities analysts say. The world's largest memory-chip maker is expected to allocate 33% of its total DRAM production capacity to higher-end HBM products for artificial-intelligence applications in 2026 and 40% in 2027, up from 27% in 2025, analysts led by Jeff Kim write in a note. By contrast, Samsung's general-purpose memory chips are likely to account for 65% of its total DRAM production capacity in 2026 and 59% in 2027, down from 73% in 2025, they note. Samsung's HBM4 products could account for about 80% of its total revenue next year, up from 40% this year, they add.