半导体未来三大支柱:先进封装、晶体管和互连

赛迪网
24 Dec 2024

英特尔在前沿技术领域的探索和布局具有行业标杆意义,其发布的技术路线图和成果为半导体行业提供了重要参考方向。在IEDM 2024大会上,英特尔发布了7篇技术论文,展示了多个关键领域的创新进展。这些技术涵盖了从FinFET到2.5D和3D封装(EMIB、Foveros、Foveros Direct),即将在Intel 18A节点应用的PowerVia背面供电技术,以及全环绕栅极(GAA)晶体管...

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