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　　建滔积层板（01888）早盘一度涨超6%，截至发稿，股价上涨5.84%，现报7.07港元，成交额2973.81万港元。

　　招商电子团队指出，在AI技术和应用的推动下，服务器将是PCB增长最快的应用领域，预计23-28年CAGR达11.6%至142亿美元。据悉，PCB制造环节包括将覆铜板（CCL）进行钻孔、镀铜、印刷、焊接等加工环节，最终形成电路板。

　　开源证券此前指出，建滔积层板为覆铜板行业龙头，伴随2024年铜价有所上涨，下游需求逐步回暖，覆铜板具备弹性调价空间，叠加供应链垂直整合与规模效应下的成本优势，有望驱动公司2024年收入与利润重回增长轨道。

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