2024年全球及中国集成式LED封装专利器件行业发展现状分析 全球市场规模近30亿元【组图】

前瞻产业研究院
27 Apr

本文核心数据:全球集成式LED封装专利器件市场规模;中国集成式LED封装专利器件市场规模集成式LED封装概念及特点——集成式LED封装概念集成式LED封装是一种区别于SMD表贴封装技术的新型封装方式,具体封装是在基底表面用高分子材料树脂覆盖LED芯片安放点,然后将LED芯片直接安放在基底表面,热处理至LED芯片牢固地固定在基底为止,随后再用丝焊的方法在LED芯片和基底之间直接建立电气连接。——...

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