IT之家 4 月 30 日消息,韩媒 sedaily 昨日(4 月 29 日)发布博文,报道称三星晶圆代工(Foundry)业务重获高通青睐,将承接高通的 2nm 芯片生产订单。该媒体援引供应链消息,三星晶圆代工业务就 2 纳米移动应用处理器(AP)的生产细节,和高通公司展开协商,并推测在 2026 年下半年推出的Galaxy Z Fold8 和 Galaxy Z Flip8两款折叠旗舰手机中,...
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