小米自研手机芯片,代工大厂曝光

芯工厂
19 May

小米自主研发设计手机SoC(手机处理器)名为“玄戒O1”,预计5月下旬发布。据悉这款芯片3nm制程,外界研判,目前仅台积电、三星和英特尔具备3nm代工能力,三星良率偏低、英特尔没有什么外部客户,玄戒O1可能由台积电代工。小米目前尚未公布玄戒O1的具体规格和关键参数。若根据2024年10月20日,北京市经济和信息化局总经济师唐建国称,小米成功Tape-out(流片)国内首款3nm芯片。业界普遍预计,...

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