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IT之家 6 月 10 日消息，美光美国爱达荷州博伊西当地时间今日宣布向多个关键客户交付其 HBM4 36GB 12Hi 内存样品。

IT之家获悉，美光的 HBM4 36GB 12Hi 基于其成熟的 1ß 工艺 24Gb DRAM Die 和 12 层堆叠封装技术，每个堆栈的速度超过 2.0TB/s，性能较上代 HBM3E 提升 60% 以上，同时能效也实现了 20% 的改进；此外其拥有强大的 MBIST 内存内置自检功能。

美光表示其 HBM4 内存提升了逻辑 xPU 与内存间的数据交互，让AI 加速器能更快地响应并更有效地进行推理。该企业计划在 2026 年实现 HBM4 的产能爬坡，与客户的下一代 AI 平台量产节奏保持一致。

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