公众号记得加星标⭐️,第一时间看推送不会错过。来源:内容编译自IEEE。本周,在IEEE 电子元件和封装技术会议上,英特尔宣布正在开发新的芯片封装技术,以便为人工智能提供更大的处理器。随着摩尔定律的放缓,先进GPU和其他数据中心芯片的制造商不得不在其产品中增加更多的硅片面积,以满足人工智能计算需求的持续增长。然而,单个硅片的最大尺寸固定在 800 平方毫米左右(只有一个例外),因此他们不得不转向...
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