在芯片的设计、制造、封测这三个主要环节中，芯片制造是门槛最高，周期最长，投资最大的，而设计则是价值最高的。所以我们看到美国之前慢慢的放弃了芯片制造，转向了芯片设计，原因就是它们觉得制造芯片吃力又不赚钱，属于重资产，让台积电、三星们等厂商去折腾吧，它们掌握设计就行了。所以像苹果、高通、AMD、英伟达、博通等等企业，均只设计芯片，不制造芯片，因为设计的价值最高，资产轻，投入也少，位于价值链顶端，收益也...
Source Link在芯片的设计、制造、封测这三个主要环节中，芯片制造是门槛最高，周期最长，投资最大的，而设计则是价值最高的。所以我们看到美国之前慢慢的放弃了芯片制造，转向了芯片设计，原因就是它们觉得制造芯片吃力又不赚钱，属于重资产，让台积电、三星们等厂商去折腾吧，它们掌握设计就行了。所以像苹果、高通、AMD、英伟达、博通等等企业，均只设计芯片，不制造芯片，因为设计的价值最高，资产轻，投入也少，位于价值链顶端，收益也...
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