浙江华章科技申请高精密单刀双回转全同步分切方法专利,解决无法保证切割质量问题

金融界
Jun 20

金融界2025年6月20日消息,国家知识产权局信息显示,浙江华章科技有限公司申请一项名为“一种高精密单刀双回转全同步分切方法”的专利,公开号 CN120172178A,申请日期为 2025 年 01 月。专利摘要显示,本申请涉及一种高精密单刀双回转全同步分切方法,包括如下步骤:S1 材料准备,将原纸卷放置到上纸机构的中央,上纸机构的液压双臂对准原纸卷的桶芯;S2 拉伸调整,将原纸卷展开后的纸张依次...

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