AI重塑存储市场,三大原厂竞争白热化

芯财富
17 Jun

AI应用快速成长,推升HBM及新存储模组需求,小型压缩附加存储模组(Small Outline Compression Attached Memory Module,SOCAMM)备受关注。随着固态技术协会(JEDEC)发布HBM4标准,三大原厂的技术竞争,将延续至下一世代。未来HBM将与逻辑芯片(logic die)进行整合,与晶圆代工伙伴密切配合。SK海力士与美光将与台积电密切合作,三星则倾向...

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