金融界2025年7月12日消息,国家知识产权局信息显示,绍兴比亚迪半导体有限公司取得一项名为“一种晶圆结构”的专利,授权公告号CN223092863U,申请日期为2024年02月。专利摘要显示,本申请实施例提供了一种晶圆结构晶圆结构包括基底层,所述基底层上设置有至少一个切割道,以将所述基底层分隔出芯片区;所述切割道内设置有阻挡部,所述阻挡部填充至少部分所述切割道。这样,在后续采用酸液进行清洁处理的...
Source Link金融界2025年7月12日消息,国家知识产权局信息显示,绍兴比亚迪半导体有限公司取得一项名为“一种晶圆结构”的专利,授权公告号CN223092863U,申请日期为2024年02月。专利摘要显示,本申请实施例提供了一种晶圆结构晶圆结构包括基底层,所述基底层上设置有至少一个切割道,以将所述基底层分隔出芯片区;所述切割道内设置有阻挡部,所述阻挡部填充至少部分所述切割道。这样,在后续采用酸液进行清洁处理的...
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