在Hot Chips 2025大会上,AMD正式公布了Instinct MI350系列AI加速卡的架构细节。该系列基于3nm制程和CDNA 4架构,采用3D多芯粒设计,集成1850亿晶体管,配备288GB HBM3e显存,总带宽达8TB/s。MI350系列包括风冷MI350X和液冷MI355X两款型号,功耗分别为1000W和1400W。该系列大幅提升大语言模型训练和推理性能,相比前代MI300,...
Source Link在Hot Chips 2025大会上,AMD正式公布了Instinct MI350系列AI加速卡的架构细节。该系列基于3nm制程和CDNA 4架构,采用3D多芯粒设计,集成1850亿晶体管,配备288GB HBM3e显存,总带宽达8TB/s。MI350系列包括风冷MI350X和液冷MI355X两款型号,功耗分别为1000W和1400W。该系列大幅提升大语言模型训练和推理性能,相比前代MI300,...
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