9月2日消息,据外资投行高盛最新发布的研究报告称,虽然中国近年来在半导体领域发展迅速,但是在半导体制造关键环节的光刻机研发上仍存在瓶颈,而中国国产光刻机目前仍停留在65纳米,至少落后国际大厂20年的时间。目前制造5nm及以下更先进制程的芯片需要依靠极紫外光(EUV)光刻机,而埃米级制程则需要用到更先进的高数值孔径(High NA)EUV光刻机,目前这些最先进的光刻机只有荷兰公司 ASML能够制造。...
Source Link9月2日消息,据外资投行高盛最新发布的研究报告称,虽然中国近年来在半导体领域发展迅速,但是在半导体制造关键环节的光刻机研发上仍存在瓶颈,而中国国产光刻机目前仍停留在65纳米,至少落后国际大厂20年的时间。目前制造5nm及以下更先进制程的芯片需要依靠极紫外光(EUV)光刻机,而埃米级制程则需要用到更先进的高数值孔径(High NA)EUV光刻机,目前这些最先进的光刻机只有荷兰公司 ASML能够制造。...
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