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半导体行业观察
Sep 09

公众号记得加星标⭐️,第一时间看推送不会错过。来源:内容来自工商时报。人工智能(AI)运算需求爆发式成长,共封装光学(CPO)技术成为半导体产业新战场,2026年将切入英伟达Rubin系列,产值上看百亿美元。 SEMICON Taiwan 2025前夕,硅光子国际论坛率先揭开序幕,台积电与英伟达(NVIDIA)再度携手,抢攻AI资料中心超级运算庞大商机。法人分析,随着英伟达Rubin架构与CPO...

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