台积电等厂商加速 FOPLP 技术布局,消息称试产良率已达 90%

IT之家
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IT之家 9 月 14 日消息,台积电等半导体厂商正在加快推进面板级扇出封装(FOPLP)技术的研发,这一新型封装技术正在快速获得行业关注。据中国台湾《工商时报》报道,供应链消息显示,目前 FOPLP 机台已经出货,客户导入测试良率达九成,但大尺寸应用仍处于“验证及小规模试产”阶段,量产尚需考虑风险与成本。图源:PixabayIT之家注:FOPLP 的全称是 Fan-Out Panel Level...

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