SEMI:2025年全球300mm晶圆厂设备支出将首次超过1000亿美元

爱集微
Oct 11

SEMI最新报告显示,预计从2026年到2028年,全球300mm晶圆厂设备支出将达到3740亿美元。SEMI预计2025年全球300mm晶圆厂设备支出将首次超过1000亿美元,增长7%,达到1070亿美元。SEMI报告预测,2026年投资将增长9%,达到1160亿美元;2027年增长4%,达到1200亿美元;2028年将增长15%,达到1380亿美元。SEMI总裁兼首席执行官Ajit ...

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