IT之家 11 月 8 日消息,中国台湾《经济日报》《联合报》报道称,台积电位于中部科学园区(中科园区)的 1.4nm 先进制程晶圆厂已于 11 月 5 日低调开工,未公开举行动工仪式。该厂计划编号为 FAB 25 厂,将用于生产 A14 制程芯片。根据中科管理局说明,厂区规划设立 4 座厂房,第一期将兴建 CUP 设备厂区、FAB 晶圆厂主厂区及办公大楼,总投资规模预估达 1.5 兆新台币(现...
Source LinkIT之家 11 月 8 日消息,中国台湾《经济日报》《联合报》报道称,台积电位于中部科学园区(中科园区)的 1.4nm 先进制程晶圆厂已于 11 月 5 日低调开工,未公开举行动工仪式。该厂计划编号为 FAB 25 厂,将用于生产 A14 制程芯片。根据中科管理局说明,厂区规划设立 4 座厂房,第一期将兴建 CUP 设备厂区、FAB 晶圆厂主厂区及办公大楼,总投资规模预估达 1.5 兆新台币(现...
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