天岳先进:已与全球前十大功率半导体器件一半以上的制造商建立业务合作关系

证券日报
Dec 02

  证券日报网讯 12月2日,天岳先进在互动平台回答投资者提问时表示,碳化硅衬底可广泛应用于功率半导体器件、射频半导体器件以及光波导、TF-SAW滤波器、散热部件等下游产品中,主要应用行业包括电动汽车、光伏及储能系统、电力电网、轨道交通、通信、AI眼镜、智能手机、半导体激光等。截至目前,公司已与全球前十大功率半导体器件制造商中一半以上的制造商建立了业务合作关系,客户主要采用公司高品质的碳化硅衬底制造功率器件及射频器件,最终用于电动汽车、AI数据中心以及光伏系统等领域。

(文章来源:证券日报)

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