中信建投:半导体设备国产化提速,先进封装有望迎积极进展

未来半导体
Dec 09

中信建投最新季度研报出炉。观点指出,未来半导体设备国产化率将迎来快速跃升,头部整机设备企业2025年订单规模有望实现20%-30%以上的增长。与此同时,半导体设备零部件领域的国产化进程也在加速推进,尤其是各类“卡脖子”零部件的国产替代节奏将显著加快,带动设备板块整体基本面持续向好。 景气度方面,机构预计2025年前道设备资本开支(CAPEX)仍将保持增长态势,先进制程延续高景气表现,成熟制程则逐步...

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