中新网上海12月22日电 (高志苗)半导体设备龙头中微公司近日披露公告,公司正筹划发行股份收购杭州众硅电子科技有限公司控股权并募集配套资金。在“科创板八条”“并购六条”等政策红利释放与产业升级需求双重驱动下,科创板半导体头部企业正掀起一场聚焦“补链强链、价值协同”的并购热潮。相关业内人士指出,2025年以来,中芯国际、华虹公司、沪硅产业、芯联集成、概伦电子等龙头企业的标志性交易正稳步推进,既彰显了...
Source Link中新网上海12月22日电 (高志苗)半导体设备龙头中微公司近日披露公告,公司正筹划发行股份收购杭州众硅电子科技有限公司控股权并募集配套资金。在“科创板八条”“并购六条”等政策红利释放与产业升级需求双重驱动下,科创板半导体头部企业正掀起一场聚焦“补链强链、价值协同”的并购热潮。相关业内人士指出,2025年以来,中芯国际、华虹公司、沪硅产业、芯联集成、概伦电子等龙头企业的标志性交易正稳步推进,既彰显了...
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