封测厂强攻先进封装 2026年资本支出暴冲至3千亿元

爱集微
Feb 15

AI 基础建设方兴未艾,先进封装产能成为 AI 时代的瓶颈之一,扩产效应也从台积电 (2330-TW)(TSM-US) 不断外溢至封测厂,包括日月光投控 (3711-TW)(ASXUS)、京元电 (2449-TW)、力成 (6239-TW)、硅格 (6257-TW)、欣铨 (3264-TW)2026 年资本支出皆大幅增长,五家合计超过 3 千亿元水准,且各自改写资本支出的新纪录。日月光投控稳居全球...

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