IBM (IBM) and Lam Research (LRCX) said Tuesday they have entered into a five-year agreement to develop new processes and materials for sub-one-nanometer logic scaling.

The collaboration will focus on creating advanced fabrication capabilities and high-resolution extreme ultraviolet lithography techniques for complex device architectures, the companies said.

The joint project will combine the technology firm's Albany research facilities with the partner's specialized processing tools and deposition systems, they said.

The engineering teams intend to build and validate complete manufacturing flows for nanosheet components and power delivery systems, the companies added.

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