【人工智能月度跟踪】CES 2026 AI前沿信息汇总

爱建证券研究所

01/12

CES 2026 AI前沿信息汇总-人工智能月度跟踪-本报告发布于2025年1月9日投资要点：事件：2026年1月6日CES展会上，NVIDIA CEO黄仁勋展示了Vera Rubin AI超级计算机平台，并宣布该产品即将量产；AMD同期推出了基于MI 455X GPU的Helios机架级AI计算方案；Intel则发布了其首款基于18A制程节点打造的计算平台。作为全球知名芯片设计公司，NVIDIA...

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Summary","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"NVDX":0.6,"3NVD.UK":0.6,"NVDA":1.98,"INTC":1.88,"AMD":1.91,"NVDS":0.6,"NVDY":0.6,"04335":1.88,"NVDD":0.6,"GFS":0.6,"SNVD.UK":0.6,"2NVD.UK":0.6,"NVDL":0.6,"NVDU":0.6,"NVD":0.6,"NVIW.SI":0.6,"NVD3.UK":0.6,"NVDS.UK":0.6,"NVD2.UK":0.6},"content_text":"CES 2026 AI前沿信息汇总-人工智能月度跟踪-本报告发布于2025年1月9日投资要点：事件：2026年1月6日CES展会上，NVIDIA CEO黄仁勋展示了Vera Rubin AI超级计算机平台，并宣布该产品即将量产；AMD同期推出了基于MI 455X GPU的Helios机架级AI计算方案；Intel则发布了其首款基于18A制程节点打造的计算平台。作为全球知名芯片设计公司，NVIDIA长期专注高性能GPU及系统芯片研发。在架构早期阶段，其通过2010年前的Tesla、2010年的Fermi、2012年的Kepler及2014年的Maxwell四大系列，推动GPU从“图形加速专用硬件”成功转型为“通用并行计算引擎”，期间持续优化可靠性、能效比与场景适配能力；2016年后，伴随AI与高性能计算需求爆发，NVIDIA加快迭代节奏，先后推出2016年的Volta（首推Tensor Core开启AI算力硬件加速）、2022年的Hopper（以Transformer Engine支撑大模型研发）、2024年的Blackwell（全栈协同设计提升AI推理与图形渲染性能）等架构，并计划通过下一代Rubin、Feynman架构突破算力密度与能效比极限，服务超复杂场景。NVIDIA推出新一代Vera Rubin AI超级计算机平台，该平台涵盖Vera CPU、Rubin GPU等6款新型芯片。凭借跨芯片极致协同设计，其不仅可将单Token推理成本降低1/10，还能把混合专家（MoE）模型训练所需的GPU数量缩减至1/4。该平台的核心为Vera Rubin Superchip，其通过NVLink-C2C互联技术，无缝整合两颗Rubin GPU与一颗Vera CPU，进而构建起统一的机架级计算执行域。1）Vera CPU专为智能体推理打造，在核心数量、内存带宽及算力等关键维度大幅超越Grace CPU；2）Rubin GPU搭载第三代Transformer引擎，在运算能力、内存带宽等核心指标上实现显著跃升。NVIDIA宣布，Vera Rubin 2026年进入全面量产阶段，AWS、Google Cloud、OCI将同步部署；同时，CoreWeave、Lambda、Nebius、Nscale等NVIDIA云生态合作伙伴也将跟进部署。AMD与Intel分别在CES 2026推出算力新品。AMD发布搭载2nm EPYC Venice Zen6 CPU与Instinct MI455X GPU的Helios AI机架平台。该平台采用全液冷设计，基础单元集成DPU与AI网卡，完整机架可提供2.9 Exaflops AI算力等强劲性能。MI455X GPU性能较前代提升10倍，EPYC Venice Zen6 CPU性能与效率提升超70%；Intel推出基于18A工艺的Intel Core™Ultra Series 3 Processors（开发代号Panther Lake），作为首款AI个人电脑平台，该系列含X9、X7 型号，旗舰款最高配备16核 CPU、12核Xe显卡及50 TOPS NPU算力。投资建议：NVIDIA最新Vera Rubin平台的发布标志着高算力GPU、CPU和高速连接芯片仍然是未来AI平台的发展方向。建议关注国产高算力GPU、CPU和连接芯片的投资机会，以及国内已经打入NVIDIA供应链的PCB等零部件供应商的投资机会。风险提示：1）国际贸易摩擦加剧2）下游需求不及预期3）技术升级进度滞后事件：CES 2026于拉斯维加斯召开事件：2026年1月6日CES拉斯维加斯展会上，NVIDIA CEO黄仁勋展示了Vera Rubin AI超级计算机平台，并宣布该产品2026年进行量产；AMD同期推出了基于MI 455X GPU的Helios机架级AI计算方案；Intel则发布了其首款基于18A制程节点打造的计算平台。1. NVIDIA发布Vera Rubin1.1 NVIDIA从Tesla、Fermi向Vera Rubin迭代升级在GPU架构的早期演进中，NVIDIA通过Tesla、Fermi、Kepler、Maxwell四大系列，实现了GPU从“图形加速专用硬件”到“通用并行计算引擎”的关键技术跃迁。2010年前，NVIDIA推出的Tesla架构，正式开启了GPU从图形加速向通用计算的跨越式转型；2010年，Fermi架构聚焦可靠性与通用性升级，不仅首次引入ECC错误校验码内存以保障数据计算准确性，还对CUDA核心进行优化，使其能支持更多编程语言；2012年，Kepler架构以“能效比革命”为核心，推出SMX流式多处理器以提升并行效率，同时首次支持GPUDirect技术，实现了GPU间及GPU与存储设备的直接数据传输；到了2014年，NVIDIA又推出Maxwell架构，该架构采用台积电28nm工艺制程。彼时移动设备兴起，市场对低功耗、高性能GPU的需求大增，NVIDIA也针对性优化了该架构在不同应用场景的适配能力。随着人工智能与高性能计算需求的持续爆发，NVIDIA自2016年后进一步加快架构迭代节奏，先后推出Volta、Hopper、Blackwell等一系列突破性架构，并计划通过下一代架构持续拓展算力边界。2016年，Volta架构凭借首创的TensorCore技术，开启AI算力硬件加速的商业化时代，为深度学习大规模落地提供关键算力支撑；2022年，Hopper架构聚焦大模型需求，以Transformer Engine夯实千亿参数模型研发基础；2024年发布的Blackwell架构，则通过“芯片-系统-软件”全栈协同设计，在AI推理效率与图形渲染性能上实现双重跃升。而NVIDIA推出的下一代架构Vera Rubin，进一步突破算力密度与能效比的极限，为超大规模AI集群、量子计算协同模拟等复杂场景提供底层技术支撑。1.2 NVIDIA Vera Rubin性能卓越新一代Vera Rubin AI超级计算机平台包含6款新型芯片：Vera CPU、Rubin GPU、NVIDIA NVLink™6交换器、NVIDIA ConnectX®-9超级网卡、NVIDIA BlueField®-4 DPU及NVIDIA Spectrum™-6以太网交换器。通过跨芯片的极致协同设计，Rubin平台可将每个Token的推理成本降低1/10，训练混合专家（MoE）模型所需的GPU数量减少至1/4。Rubin平台的核心是NVIDIA Vera Rubin Superchip，其CPU与GPU的性能跃升尤为值得关注。每颗超级芯片借助支持内存一致性的NVLink-C2C互联技术，无缝整合两颗Rubin GPU与一颗Vera CPU，彻底打破传统CPU与GPU的架构壁垒，进而构建起统一的机架级计算执行域。1）Vera Rubin CPU专为智能体推理而设计，是面向大规模AI工厂的能效最高的CPU。这款芯片内置88个核心、176条线程，拥有1.8 TB/s的NVLink-C2C一致性内存互连、1.5TB系统内存（相当于Grace的3倍）、1.2TB/s的SOCAMM LPDDR5X内存带宽，并支持机架级机密计算。整体算力、压缩和CI/CD性能均比Grace提升2倍。2）Rubin GPU采用第三代Transformer引擎与硬件加速自适应压缩技术，可提供50 petaflops的NVFP4运算能力。其HBM4内存带宽提升至22TB/s（相较前代提升2.8X），单GPU的NVLink互连带宽提升至3.6TB/s（相较前代提升2X）。系统架构层面，Rubin平台实现100%全液冷覆盖，采用第三代完全无缆化设计重构硬件形态，旗舰产品Vera Rubin NVL72机架式系统采用无缆化、无风扇模块化设计，构建“精准温控+高效换热”的整机散热生态。1.3 NVIDIA宣布Vera Rubin 2026年进入全面量产阶段NVIDIA宣布，Vera Rubin于2026年正式进入全面量产阶段。2026年首批部署Vera Rubin的云厂商包括AWS、Google Cloud、OCI等；同时，英伟达的云生态合作伙伴CoreWeave、Lambda、Nebius与Nscale也将同步跟随部署。1）微软将部署英伟达Vera Rubin NVL72机架级系统，将其纳入新一代AI数据中心的核心基础设施，并应用于未来的Fairwater AI超级工厂等场地。2）CoreWeave 计划于2026H2，将英伟达Rubin系统全面整合至自有AI云平台。该平台具备多架构并行运行能力，可支持客户将Rubin技术接入自有业务环境，最大化释放训练、推理及代理型工作负载的效能。2. AMD发布“Helios”机架级平台CES 2026大会上，AMD发布了搭载2nm EPYC Venice Zen6CPU与Instinct MI455X GPU的Helios AI机架平台。该机架采用全液冷设计，基础单元配置为1颗EPYC Venice Zen6 CPU搭配4张Instinct MI455X GPU，同时集成Pensando“Salina”400 DPU与“Vulcano”800 AI网卡，分别承担数据处理与高速互联任务；扩展至完整机架形态后，可提供2.9 Exaflops AI算力、31TB HBM4内存与43TB/s扩展带宽，最多集成4600个CPU核心与18000个GPU核心。同时，苏姿丰展示了MI445X GPU与EPYC Venice Zen 6 CPU。MI455X GPU配备了两个巨大的GCD（图形计算芯片）、两个MCD（内存控制器芯片）以及总共16个HBM4显存位点。MI455X的性能比MI355X提高了10倍。EPYC Venice Zen 6 CPU配备8个大型Zen 6C CCD（核心计算芯片）、两个IOD（输入输出芯片）及带管理控制器的微型芯片。AMD称其性能与效率提升超70%，线程密度提升超30%。该芯片还将推出标准的192核Zen 6版本，配备16个CCD，每个CCD包含12个Zen 6核心，以及768MB的L3缓存。3. Intel发布Core Ultra Series 3 Processors在CES 2026上，Intel发布了Intel Core™Ultra Series 3 Processors（开发代号Panther Lake），标志着首个基于英特尔18A工艺技术的AI个人电脑平台的首次亮相。该系列含全新命名的X9、X7型号，集成高端锐炫显卡，旗舰款最高配备16核CPU、12核Xe显卡及50 TOPS NPU算力。其中，酷睿Ultra X9 388H在相近功耗下，多线程性能较Lunar Lake提升60%，游戏性能提升77%，电池续航最长达27小时。首批搭载Intel Core™ Ultra Series 3 Processors的消费级笔记本电脑，将于2026年1月6日启动预售，并自2026年1月27日起在全球范围内正式面市。4.风险提示1）国际贸易摩擦加剧2）下游需求不及预期3）技术升级进度滞后文章来源本文节选自：2025年1月9日发布的《人工智能月度跟踪：CES 2026 AI前沿信息汇总》分析师：许亮执业证书编号：S0820525010002邮箱：xuliang@ajzq.com联系人：朱俊宇执业证书编号：S0820125040021邮箱：zhujunyu@ajzq.com如需全文，请联系爱建电子团队或对口销售。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":1,"need_auth":false,"code":"91000000","status":"200"}}}