美股详情

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半导体精选

3,396.61

+148.474.57%

涨家数：15

跌家数：2

平家数：- -

市盈率：- -

高：3,417.76

开：3,251.90

低：3,251.90

收：3,248.13

数据加载中...

总览新闻资讯

超微因预期下调而下滑，分析师淡化对更广泛人工智能需求的担忧

英特尔举办2025代工大会：18A下半年开始量产，代工客户崭露头角

Ofweek维科网

瑞芯微：今年计划推出协处理器解决方案

英伟达(NVDA.O)盘前下跌1.7%，AMD(AMD.O)跌0.7%，此前超微电脑(SMCI.O)下调盈利预期。

美股异动丨台积电盘前涨超1% 美国亚利桑那州第三座晶圆厂开建

台积电在美巨亏在大陆盈利：我国回应把自己卖了还以“媚美”为荣

半导体大厂公布新任CEO

全球半导体观察

台积电亚利桑那州第三座晶圆厂动工

四年五个节点已投入900亿美元！Intel：18A今年量产

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13:33","pubTimestamp":1745991180,"startTime":"0","endTime":"0","summary":"全球芯片代工巨头台积电在美国亚利桑那州的第三座晶圆厂动工，加速在美国的扩张。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"zaobao_highlight","url":"https://www.zaobao.com/realtime/china/story20250430-6268151","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zaobao.com/realtime/china/story20250430-6268151","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"corporation","news_rank":0,"length":0,"strategy_id":0,"source":"zaobao_highlight","symbols":["SGXZ99366536.SGD","SG9999004220.SGD","LU2125154778.USD","03145","LU2750360641.GBP","IE00BD6J9T35.USD","LU2089284900.SGD","LU1917777945.USD","LU1989772923.USD","BK4534","BK4605","LU0792757196.USD","IE00BQXX3C00.GBP","LU1282649810.SGD","LU2125154935.USD","BK4588","BK4141","LU0572939691.SGD","LU2249611893.SGD","LU2506951792.HKD","LU1868837722.USD","BK4543","LU2089283258.USD","LU2023251221.USD","LU0094547139.USD","LU2471134796.USD","LU2294711713.HKD","LU0823421333.USD","BK4554","LU1974910355.USD","LU0823414551.USD","LU2471134879.HKD","IE00BFXG0V08.USD","BK4532","LU2237443622.USD","LU2663582299.SGD","LU1508157978.USD","LU0384037296.USD","LU2106854487.HKD","SGXZ81514606.USD","LU1803068979.SGD","LU0488056044.USD","TSM","LU2471134952.CNY","LU1282649067.USD","BK4527","BK4591","LU0823414478.USD","LU0109392836.USD","LU0264606111.USD"],"gpt_icon":1},{"id":"2531724472","title":"四年五个节点已投入900亿美元！Intel：18A今年量产","url":"https://stock-news.laohu8.com/highlight/detail?id=2531724472","media":"快科技","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2531724472?lang=zh_cn&edition=fundamental","pubTime":"2025-04-30 11:48","pubTimestamp":1745984896,"startTime":"0","endTime":"0","summary":"Intel披露的数据显示，在2021年提出“四年五个工艺节点”计划至2024年这四年间，Intel在全球的资本支出达到了900亿美元。Intel表示，18A制程节点已进入风险试产阶段，预计将在今年实现量产，而18A之后的下一代14A工艺制程，则将在2027年前后进入风险生产阶段。成熟节点方面，Intel代工流片的首批基于16纳米制程的产品已经进入晶圆厂生产，还正在与主要客户洽谈与UMC合作开发的12纳米节点及其演进版本。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://tech.ifeng.com/c/8iyGTTnnJLR","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"fenghuang_stock","symbols":["BK4529","BK4550","BK4588","LU0321505439.SGD","BK4579","BK4575","BK4527","BK4534","BK4543","BK4512","LU0081259029.USD","LU0321505868.SGD","LU2543165471.USD","BK4535","INTC","BK4533","BK4605","BK4554","BK4515","BK4585","BK4602","BK4141","BK4612"],"gpt_icon":1}],"pageSize":20,"totalPage":14,"pageCount":14,"totalSize":269,"code":"91000000","status":"200"}]}}