美股详情

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苹果概念

2,990.28

-21.4771-0.71%

涨家数：7

跌家数：20

平家数：- -

市盈率：- -

高：3,012.08

开：3,012.08

低：2,962.13

收：3,011.76

数据加载中...

威世科技盘中异动临近午盘急速拉升5.05%

英特尔股价下跌近5%

英特尔跌超5%公司考虑调整芯片代工业务战略押注14A先进制程争台积电客户。

方飞：荣耀折叠屏已接近无人区期待苹果加入折叠屏赛道

美股异动丨英特尔大跌超5%，考虑调整晶圆厂代工业务战略

英特尔股价下跌4.5%。

英特尔“豪赌”！跳过18A直攻14A，是弯道超车还是自陷巨坑？

TradingKey中文

三星收购部分英特尔半导体专利权

消息称台积电为专注在高成长市场近期已陆续缩减在成熟制程的资源并有意淡出氮化镓（GaN）市场GaN产品所在的晶圆五厂仅供应

西部数据7月1日成交额为3.42亿美元

2nm版高通骁龙8 Elite 2首曝：三星代工

安森美AI数据中心系统方案指南上线

德州仪器7月1日成交额为12.29亿美元

TTM科技7月1日成交额为8387.07万美元

挑战6纳米，联电正探索与英特尔进一步扩大合作可能性

全球半导体观察

希捷科技7月1日成交额为7.17亿美元

据报英特尔或放弃18A制程芯片外部销售将更多资源集中于14A

Qorvo, Inc.7月1日成交额为1.53亿美元

高通7月1日成交额为14.27亿美元

英特尔申请用于嵌入衬底核心中的部件的堆叠体技术专利，向功率部件和衬底核心提供机械稳定性

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2芯片，工艺升级为三星SF2 ，套片报价比台积电3nm版本更低，明年可能会上线。他还爆料，目前没有厂商采购三星2nm版骁龙8 Elite 2，高通主要供货的是台积电3nm版。根据此前曝光的消息，今年9月登场的骁龙8 Elite 2基于台积电N3P工艺制造，并采用第二代自研Oryon CPU架构，GPU独立缓存提升至16MB。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/stock/t/2025-07-02/doc-infeafyp4525976.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["BK4561","BK4141","LU2023250504.SGD","SG9999015945.SGD","LU1261432733.SGD","LU1084165304.USD","LU0081259029.USD","LU1035775433.USD","BK4585","LU1119994496.HKD","LU1917777945.USD","BK4534","LU1823568750.SGD","LU0061475181.USD","LU0868494617.USD","SG9999015986.USD","BK4554","BK4604","LU0079474960.USD","SG9999015978.USD","BK4575","LU1046421795.USD","BK4605","LU2247934214.USD","BK4612","LU0868494708.USD","BK4581","BK4515","BK4512","LU1069344957.HKD","IE00BSNM7G36.USD","LU2106854487.HKD","SG9999001424.SGD","BK4579","QCOM","IE00BGHQDM52.EUR","SG9999015952.SGD","BK4532","BK4598","LU0942090050.USD","BK4527","BK4573","IE00BVYPNP33.GBP","IE00BVYPNQ40.USD","BK4588","LU1974910355.USD","GB00BDT5M118.USD"],"gpt_icon":0},{"id":"2548850311","title":"安森美AI数据中心系统方案指南上线","url":"https://stock-news.laohu8.com/highlight/detail?id=2548850311","media":"工控网","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2548850311?lang=zh_cn&edition=fundamental","pubTime":"2025-07-02 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纳米属于先进制程，主要应用于AI加速器、无线通讯及车用芯片等领域，制程与前代有明显差异。是否采购EUV设备，成为联电是否进入6纳米制程的关键抉择。业界估算，建造具备月产两万片晶圆能力的6纳米产线，总资本支出可能高达50亿美元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250702141544a4ca7762&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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14:02","pubTimestamp":1751436132,"startTime":"0","endTime":"0","summary":"美东时间2025年7月1日，希捷科技成交额为7.17亿美元，成交额较昨日增加36.37%，当日成交量为495.14万股。希捷科技于2025年7月1日涨0.49%，报145.04美元，该股过去5个交易日涨6.97%，年初至今涨70.32%，过去60日涨103.85%。|近5个交易日成交情况||||#|日期|成交额（美元）|成交额较昨日变化|成交量（股）|#|2025-07-01|7.17亿|36.37%|495.14万|#|2025-06-30|5.26亿|-20.05%|366.38万|#|2025-06-27|6.58亿|53.95%|465.11万|#|2025-06-26|4.27亿|-13.38%|304.71万|#|2025-06-25|4.93亿|-22.56%|357.49万|希捷是为企业和消费者市场提供数据存储硬盘驱动器的领先供应商。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250702140220a4ca71fd&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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行政总裁陈立武考虑对芯片代工业务进行重大改革，放弃由前任基辛格重点推动的18A制程芯片，将更多资源集中于下一代制程工艺14A，相信会较台积电正研发的N2技术更具优势，以争取苹果及英伟达等大客户。消息人士指，如果放弃18A及其衍生版本18A-P制程工艺的外部销售，英特尔将不得不进行资产减值，由于公司在研发上已耗费数十亿美元，估计一旦落实可能会造成数以亿美元计的损失。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250702134136953380d8&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Inc.7月1日成交额为1.53亿美元","url":"https://stock-news.laohu8.com/highlight/detail?id=2548608851","media":"市场透视","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2548608851?lang=zh_cn&edition=fundamental","pubTime":"2025-07-02 13:02","pubTimestamp":1751432545,"startTime":"0","endTime":"0","summary":"美东时间2025年7月1日，Qorvo, Inc.成交额为1.53亿美元，成交额较昨日增加2.03%，当日成交量为177.89万股。Qorvo, Inc.于2025年7月1日涨1.38%，报86.08美元，该股过去5个交易日涨5.5%，年初至今涨23.09%，过去60日涨40.91%。Qorvo还面向各种非智能手机终端市场销售一系列产品，如无线基站、有线电视和网络设备，以及基础设施和军事应用。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250702130234a729c885&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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13:00","pubTimestamp":1751432439,"startTime":"0","endTime":"0","summary":"美东时间2025年7月1日，高通成交额为14.27亿美元，成交额较昨日增加12.37%，当日成交量为894.23万股。高通于2025年7月1日涨0.09%，报159.4美元，该股过去5个交易日涨2.37%，年初至今涨4.96%，过去60日涨15.02%。|近5个交易日成交情况||||#|日期|成交额（美元）|成交额较昨日变化|成交量（股）|#|2025-07-01|14.27亿|12.37%|894.23万|#|2025-06-30|12.70亿|-63.80%|798.82万|#|2025-06-27|35.08亿|254.18%|2210.03万|#|2025-06-26|9.90亿|20.46%|627.82万|#|2025-06-25|8.22亿|-31.30%|528.01万|高通公司开发和授权无线技术，并为智能手机设计芯片。高通公司 的 IP 已获得几乎所有无线设备制造商的许可。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250702130043a729c7de&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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12:42","pubTimestamp":1751431366,"startTime":"0","endTime":"0","summary":"金融界2025年7月2日消息，国家知识产权局信息显示，英特尔公司申请一项名为“用于嵌入衬底核心中的部件的堆叠体的技术”的专利，公开号CN120239285A，申请日期为2024年11月。专利摘要显示，公开了用于嵌入衬底核心中的部件的技术。以这种方式配置功率部件可以向功率部件和衬底核心提供机械稳定性，并且向安装在电路板上的半导体管芯提供功率。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.jrj.com.cn/2025/07/02124251434483.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"jinrongjie_stock","symbols":["BK4512","BK4550","BK4612","LU0321505439.SGD","LU2543165471.USD","BK4527","BK4579","BK4141","LU0321505868.SGD","BK4535","BK4529","BK4533","BK4515","BK4534","LU0081259029.USD","BK4585","BK4575","BK4605","BK4588","INTC","BK4543","BK4602","BK4554"],"gpt_icon":0}],"pageSize":20,"totalPage":22,"pageCount":20,"totalSize":439,"code":"91000000","status":"200"}]}}