美股详情

本页面由Tiger Trade Technology Pte. Ltd.提供服务

Columbia Select Technology ETF

30.42

+0.14810.49%

成交量：8,767.00

成交额：26.63万

市值：3,726.22万

市盈率：- -

高：30.45

开：30.34

低：30.27

收：30.27

52周最高：33.77

52周最低：18.71

股本：122.50万

流通股本：122.50万

量比：0.63

换手率：0.72%

股息：1.37

股息率：4.52%

净资产收益率：--

总资产收益率：--

市净率：--

市盈率(LYR):- -

数据加载中...

总览公司新闻资讯公告

宜昌市猇亭区：“绿色智造”锻造现代化工新名片

中国新闻网

【湾区早参】香港最新失业率维持于3.8%；深圳瞪羚企业数首超伦敦

【财经早报】2025-12-18 星期四

【今日主题前瞻】一天一个价，存储芯片或迎以AI驱动的新一轮景气周期

存储芯片急单涌现，3D NAND代工“风口”属于谁？

21世纪经济报道

光刻胶新突破，资金加仓概念股出炉

未来三年，全球300毫米晶圆厂设备支出将突破3740亿美元

半导体新知道

SEMI：2025年全球300mm晶圆厂设备支出将首次超过1000亿美元

SEMI预测到2030年半导体市场将达到1万亿美元

电子产品世界

长川科技密集资本运作，发生了什么？

芯片设备，最新预测

半导体行业观察

陈立武：晶圆代工业务“增加三倍”

美国晶圆厂投资，将超过中国大陆、中国台湾和韩国

半导体行业观察

联得半导体将携多款核心设备亮相深圳国际半导体展览会

{"basename":"/hans","ssrTDKData":{"titleTemplate":"%s - 老虎证券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","keywords":"老虎证券,老虎证券开户,老虎券商,老虎证券官网,老虎证券app,tigertrade老虎证券,股票,炒股,新加坡股票交易平台,投资,投资理财","social":{"ogDescription":"老虎证券助您一站式投资美股，新股，港股，A股等全球金融理财产品。新加坡华人最信赖的在线投资平台，现在加入即享低费用，24/5 无时差炒美股投资理财！","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hans/stock/SEMI/news"},"companyName":"老虎证券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental","symbol":"SEMI","isAnalysisPage":false},"__swrFallback__":{"@#url:\"https://hq.skytigris.cn/stock_info/detail/global\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"SEMI\",,,,,undefined,":{"symbol":"SEMI","market":"US","secType":"STK","nameCN":"Columbia Select Technology ETF","latestPrice":30.4181,"timestamp":1773777600000,"preClose":30.27,"halted":0,"volume":8767,"delay":0,"changeRate":0.004892632969937214,"floatShares":1225000,"shares":1225000,"eps":0,"marketStatus":"盘前交易","change":0.1481,"latestTime":"03-18 04:37:12 EDT","open":30.34,"high":30.45,"low":30.265,"amount":266267.792,"amplitude":0.006112,"askPrice":48.36,"askSize":100,"bidPrice":12.23,"bidSize":100,"shortable":3,"etf":1,"ttmEps":0,"tradingStatus":1,"nextMarketStatus":{"tag":"开盘","tradingStatus":2,"beginTime":1773840600000},"marketStatusCode":1,"adr":0,"listingDate":1400731200000,"exchange":"ARCA","adjPreClose":30.4181,"sharesOutstanding":1200000,"nav":30.23321,"aum":37035681.78,"dividendRate":0.045184,"bidAskSpread":0,"postHourTrading":{"tag":"盘后","latestPrice":30.37,"preClose":30.4181,"latestTime":"17:47 EDT","volume":17,"amount":521.1348,"timestamp":1773784075056,"change":-0.0481,"changeRate":-0.001581,"amplitude":0},"volumeRatio":0.629350560218267},"@#url:\"https://hq.skytigris.cn/stock_info/fundamental/all\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"SEMI\",,,,,undefined,":{"symbol":"SEMI","floatShares":1225000,"roa":"--","roe":"--","lyrEps":0,"volumeRatio":0.629350560218267,"shares":1225000,"dividePrice":1.3744,"high":30.45,"amplitude":0.006112,"preClose":30.27,"low":30.265,"week52Low":18.71,"pbRate":"--","week52High":33.7735,"institutionHeld":0,"latestPrice":30.4181,"eps":0,"divideRate":0.045184,"volume":8767,"delay":0,"ttmEps":0,"open":30.34,"prevYearClose":30.6329,"prevWeekClose":29.75,"prevMonthClose":30.55,"prevQuarterClose":30.6329,"fiveDayClose":30.49,"twentyDayClose":30.622,"sixtyDayClose":30.527},"@#url:\"https://hq.skytigris.cn/fundamental/corporate_actions/details/SEMI\",params:#limit:5,,,undefined,":[{"date":"2025-12-18","symbol":"SEMI","amount":1.37382,"announcedDate":"2025-12-17","type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2025-12-18","defaultRemindTime":1766068200000,"name":"Columbia Select Technology ETF","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2025-12-26","payableDate":"2025-12-18","currency":"USD","dateTimestamp":1766034000000,"payDate":"2025-12-26"},{"date":"2024-12-18","symbol":"SEMI","amount":0.24729,"announcedDate":null,"type":"dividend","lastAmount":null,"market":"US","newRecordDate":"2024-12-18","defaultRemindTime":1734532200000,"name":"COLUMBIA SELIGMAN SEMICONDUCTOR AND TECHNOLOGY ETF","lastCurrency":null,"lastExecuteDate":null,"recordDate":"2024-12-26","payableDate":"2024-12-18","currency":"USD","dateTimestamp":1734498000000,"payDate":"2024-12-26"},{"date":"2023-12-18","symbol":"SEMI","amount":0.19531,"announcedDate":"2023-12-15","type":"dividend","market":"US","newRecordDate":"2023-12-19","defaultRemindTime":1702909800000,"name":"COLUMBIA SELIGMAN SEMICONDUCTOR AND TECHNOLOGY ETF","recordDate":"2023-12-26","payableDate":"2023-12-19","currency":"USD","dateTimestamp":1702875600000,"payDate":"2023-12-26"},{"market":"US","date":"2022-12-19","symbol":"SEMI","amount":0.10393,"defaultRemindTime":1671460200000,"name":"COLUMBIA SELIGMAN SEMICONDUCTOR AND TECHNOLOGY ETF","recordDate":"2022-12-27","payableDate":"2022-12-20","currency":"USD","type":"dividend","dateTimestamp":1671426000000},{"market":"US","date":"2016-11-03","symbol":"SEMI","fiscalQuarterEnding":null,"expectedEps":-0.44,"name":null,"time":"","type":"earning","dateTimestamp":1478145600000,"reportTimeType":"","actualEps":null}],"@#url:\"https://hq.skytigris.cn/fundamental/dividend/history\",params:#symbol:\"SEMI\",market:\"US\",,,undefined,":[{"executeDate":"2022-12-19","recordDate":"2022-12-20","paymentDate":"2022-12-27","value":0.10393,"currency":"USD"},{"executeDate":"2023-12-18","recordDate":"2023-12-19","paymentDate":"2023-12-26","value":0.19531,"currency":"USD"},{"executeDate":"2024-12-18","recordDate":"2024-12-18","paymentDate":"2024-12-26","value":0.24729,"currency":"USD"},{"executeDate":"2025-12-18","recordDate":"2025-12-18","paymentDate":"2025-12-26","value":1.37382,"currency":"USD"}],"@#url:\"https://hq.skytigris.cn/fundamental/estimate/recommendation\",params:#symbol:\"SEMI\",market:\"US\",delay:false,,,undefined,":{},"$inf$@#url:\"https://stock-news.skytigris.cn/v2/news/list\",params:#symbols:\"SEMI\",pageSize:20,pageCount:1,lang_content:\"cn\",edition:\"fundamental\",,,undefined,":[{"items":[{"id":"2606207702","title":"宜昌市猇亭区：“绿色智造”锻造现代化工新名片","url":"https://stock-news.laohu8.com/highlight/detail?id=2606207702","media":"中国新闻网","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2606207702?lang=zh_cn&edition=fundamental","pubTime":"2026-01-27 17:47","pubTimestamp":1769507220,"startTime":"0","endTime":"0","summary":"中新网湖北新闻1月27日电 近年来，宜昌市猇亭区坚持生态优先、绿色发展，以“高端化、绿色化、智能化”为方向，依托兴发集团等龙头企业，形成有机硅新材料、电子级化学品两大核心增长极，现代化工新材料产业集聚效应持续凸显，综合竞争力稳步攀升。聚力转型攻坚，绿色智能生态加速构建“十四五”时期，猇亭区以绿色化、智能化为重要抓手，全力推动现代化工新材料产业转型升级。","market":"other","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"sina","url":"https://finance.sina.com.cn/roll/2026-01-27/doc-inhitxiw5609915.shtml","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, .action","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/roll/2026-01-27/doc-inhitxiw5609915.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["SEMI"],"gpt_icon":0},{"id":"2605123911","title":"【湾区早参】香港最新失业率维持于3.8%；深圳瞪羚企业数首超伦敦","url":"https://stock-news.laohu8.com/highlight/detail?id=2605123911","media":"金吾财讯","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2605123911?lang=zh_cn&edition=fundamental","pubTime":"2026-01-21 08:46","pubTimestamp":1768956372,"startTime":"0","endTime":"0","summary":"就业不足率方面，上升主要见于运输业和资讯及通讯业。同期，清洁及同类活动业的就业不足率录得下跌。中国占胡润全球瞪羚总数的34%。深圳33家胡润瞪羚，首次超越伦敦，跻身全球前五。","market":"other","thumbnail":"https://static.szfiu.com/news/20241108/MzQxNzMxMDUyMTQyMzY4.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20241108/MzQxNzMxMDUyMTQyMzY4.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"1973610","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["SG9999001051.SGD","IE0031814852.USD","BK1168","BK1576","03339","BK1589","LU0261947096.USD","LU1188198961.HKD","SGXZ90724238.SGD","82020","LU0251144936.SGD","LU0314109678.HKD","LU1328277881.USD","BK1141","IE00BGV7N243.SGD","LU0594300179.USD","LU0048575426.USD","HK0000252160.HKD","LU0048597586.USD","LU0052750758.USD","IE0008368742.USD","BK1512","LU2008162690.USD","LU0274383008.USD","LU0251143458.SGD","LU0326950275.SGD","00522","BK1096","LU0650527681.SGD","BK1502","LU0320764599.SGD","01070","HK0000252152.HKD","IE00BQXX3D17.EUR","IE00BQXX3F31.USD","LU0605514214.HKD","LU0594300419.USD","02020","BK1169","02419","06127","IE00B031J352.USD","BK1557","SEMI","LU0348784397.USD","LU0488056044.USD","BK1505","ANPDY","LU0463099449.HKD","LU0648948544.HKD"],"gpt_icon":0},{"id":"2592894272","title":"【财经早报】2025-12-18 星期四","url":"https://stock-news.laohu8.com/highlight/detail?id=2592894272","media":"市场资讯","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2592894272?lang=zh_cn&edition=fundamental","pubTime":"2025-12-18 08:28","pubTimestamp":1766017680,"startTime":"0","endTime":"0","summary":"12月17日晚间，上述3家上市券商同步披露重大资产重组预案。根据预案，此次交易定价以各方董事会决议公告日前20个交易日均价作为基准价格，东兴证券、信达证券与中金公司A股的换股比例分别为1∶0.4373、1∶0.5188。此外，这3家券商股票于12月18日复牌。","market":"other","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"603ac6dae346ff240c6654196edb95ea","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/roll/2025-12-18/doc-inhceprt6572196.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["IMF","BK4086","BK4568","IEC","APT","SEMI"],"gpt_icon":0},{"id":"2590137800","title":"【今日主题前瞻】一天一个价，存储芯片或迎以AI驱动的新一轮景气周期","url":"https://stock-news.laohu8.com/highlight/detail?id=2590137800","media":"中金财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2590137800?lang=zh_cn&edition=fundamental","pubTime":"2025-12-10 08:08","pubTimestamp":1765325298,"startTime":"0","endTime":"0","summary":"2026年第二季度美光传统DRAM毛利率预计达67%，首次超越HBM的62%。此后这一优势将持续扩大，第三季度传统DRAM毛利率将达71%，第四季度更是高达75%。万联证券研报指出，当前存储芯片有望迎来以AI驱动的新一轮景气周期，需求拉动力更强、存储技术迭代进一步加速、供给端产能调控策略升级，同时短期供给端新增产能有限，供需缺口有望维持，本轮存储行业涨价持续性或更强。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://sc.stock.cnfol.com/shichangceping/20251210/31854900.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"zhongjincaijing_highlight","symbols":["BK4023","QTUM","BK4551","BK4585","BK4587","BK4528","SEMI","BK4543","BK4588"],"gpt_icon":1},{"id":"2584948652","title":"存储芯片急单涌现，3D NAND代工“风口”属于谁？","url":"https://stock-news.laohu8.com/highlight/detail?id=2584948652","media":"21世纪经济报道","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2584948652?lang=zh_cn&edition=fundamental","pubTime":"2025-11-19 19:01","pubTimestamp":1763550112,"startTime":"0","endTime":"0","summary":"“支撑AI大模型的底层基础设施——服务器、数据中心、存储，有望从2024年的1490亿美元增长到2030年的3400亿美元，是半导体市场中增长最快的部分。”11月19日，国际半导体产业协会（SEMI）中国总裁冯莉在2025年产业链供应链国际合作交流会暨企业家太湖论坛分论坛——集成电路产业链合作对接交流会上指出。","market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"stock_eastmoney","url":"http://finance.eastmoney.com/a/202511193568934722.html","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202511193568934722.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["BK4585","SEMI","BK4551","BK4023","BK4543","BK4588","BK4587","AI","BK4528"],"gpt_icon":0},{"id":"2578670687","title":"光刻胶新突破，资金加仓概念股出炉","url":"https://stock-news.laohu8.com/highlight/detail?id=2578670687","media":"数据宝","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2578670687?lang=zh_cn&edition=fundamental","pubTime":"2025-10-26 12:13","pubTimestamp":1761451980,"startTime":"0","endTime":"0","summary":"光刻技术是推动集成电路芯片制程工艺持续微缩的核心驱动力之一。　　据科技日报，近日，北京大学化学与分子工程学院彭海琳教授团队及合作者通过冷冻电子断层扫描技术，首次在原位状态下解析了光刻胶分子在液相环境中的微观三维结构、界面分布与缠结行为，指导开发出可显著减少光刻缺陷的产业化方案。　　“显影”是光刻的核心步骤之一，通过显影液溶解光刻胶的曝光区域，将电路图案精确转移到硅片上。","market":"other","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/roll/2025-10-26/doc-infvexcq4756707.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["BK4585","BK4588","SOXX","SEMI","OLED","SMH","BK4518","BK4573","BK4141"],"gpt_icon":1},{"id":"2575622534","title":"未来三年，全球300毫米晶圆厂设备支出将突破3740亿美元","url":"https://stock-news.laohu8.com/highlight/detail?id=2575622534","media":"半导体新知道","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2575622534?lang=zh_cn&edition=fundamental","pubTime":"2025-10-15 06:30","pubTimestamp":1760481044,"startTime":"0","endTime":"0","summary":"国际半导体产业协会最新发布的《300毫米晶圆厂展望》报告显示，2026年至2028年，全球300毫米晶圆厂设备支出将累计达3740亿美元。从整体趋势看，2025年将成为关键起点，全球300毫米晶圆厂设备支出预计首次突破1000亿美元大关，同比增长7%至1070亿美元；随后三年将持续攀升，2026年增长9%至1160亿美元，2027年增长4%至1200亿美元，2028年更将大幅增长15%至1380亿美元。内存领域紧随其后，三年总支出预计达1360亿美元，开启新一轮增长周期。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015063215a460377c&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251015063215a460377c&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4543","SMH","BK4515","BK4585","LU0321505868.SGD","NVDA","BK4605","BK4588","BK4612","00981","BK4554","BK4529","SOXX","AVGO","BK4533","BK4141","LU2543165471.USD","SEMI","BK4168","LU0321505439.SGD","BK4527","HBM","BK4512","LU2148611432.USD","BK4575","BK4579","LU0081259029.USD","BK4602","TSM","BK4535","BK4550","BK4534","INTC","GAA"],"gpt_icon":1},{"id":"2574443636","title":"SEMI：2025年全球300mm晶圆厂设备支出将首次超过1000亿美元","url":"https://stock-news.laohu8.com/highlight/detail?id=2574443636","media":"爱集微","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2574443636?lang=zh_cn&edition=fundamental","pubTime":"2025-10-11 13:54","pubTimestamp":1760162074,"startTime":"0","endTime":"0","summary":"SEMI预计2025年全球300mm晶圆厂设备支出将首次超过1000亿美元，增长7%，达到1070亿美元。SEMI报告预测，2026年投资将增长9%，达到1160亿美元；2027年增长4%，达到1200亿美元；2028年将增长15%，达到1380亿美元。模拟相关领域预计将在未来三年内投资超过410亿美元。按地区来看，中国大陆预计将继续领先全球300mm设备支出，2026至2028年间投资总额将达940亿美元。韩国预计将以860亿美元的投资额位居全球第二，支撑全球生成式AI需求。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251011135621a45a2913&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251011135621a45a2913&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["BK4527","BK4553","BK4532","LU0082616367.USD","LU2360106780.USD","LU2931357623.SGD","SEMI","LU0157215616.USD","LU1267930813.SGD","BK4512","BK4588","01347","00981","BK4575","GB00BDT5M118.USD","LU2048586759.USD","LU2286300806.USD","BK4605","LU1366333091.USD","LU0274383776.USD","BK4566","IE00B19Z3B42.SGD","LU0056508442.USD","LU0642271901.SGD","BK4554","BK4533","IE00B19Z3581.USD","BK4579","LU0127658192.USD","LU0719512351.SGD","LU1852331112.SGD","LU0081259029.USD","LU2250418816.HKD","IE00B7SZLL34.SGD","LU0889566641.SGD","MU","TSM","LU0792757196.USD","IE0002270589.USD","LU2211815571.USD","BK4543","BK4141","LU2089985449.USD","BK4585","LU1316542783.SGD"],"gpt_icon":1},{"id":"2574148877","title":"SEMI预测到2030年半导体市场将达到1万亿美元","url":"https://stock-news.laohu8.com/highlight/detail?id=2574148877","media":"电子产品世界","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2574148877?lang=zh_cn&edition=fundamental","pubTime":"2025-10-10 11:07","pubTimestamp":1760065629,"startTime":"0","endTime":"0","summary":"根据SEMI的 300 毫米晶圆厂展望报告，到 2025 年，300 毫米晶圆厂设备的支出预计将达到 1070 亿美元。预计该行业今年将增长 7%，到 2026 年将增长 9%，达到 1160 亿美元，到 2027 年增长 4%，随后增长 15%，到 2028 年全球总支出将达到 1380 亿美元。未来三年，SEMI行业研究和统计总监Clark Tseng（如图）在亚利桑那州凤凰城的Semicon West发表讲话时说，未来三年的总支出将达到3740亿美元。半导体行业的周期性意味着增长率将逐渐减弱，但尽管如此，SEMI预计到 2030 年该行业的收入将超过 1 万亿美元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025101011071194c146ce&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025101011071194c146ce&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU0056508442.USD","SMH","00981","SOXX","LU0127658192.USD","IE0002270589.USD","IE00B7SZLL34.SGD","GB00BDT5M118.USD","LU0792757196.USD","BK4141","01347","BK4512","BK4566","LU1316542783.SGD","LU0719512351.SGD","04335","BK4532","BK4527","LU2286300806.USD","BK4579","LU2360106780.USD","LU0081259029.USD","INTC","LU2048586759.USD","LU2089985449.USD","BK4543","04336","BK4553","IE00B19Z3581.USD","LU0082616367.USD","LU0274383776.USD","LU1366333091.USD","BK4605","LU0889566641.SGD","LU2211815571.USD","TSM","BK4554","LU2931357623.SGD","MU","BK4533","LU2250418816.HKD","IE00B19Z3B42.SGD","LU0157215616.USD","SEMI","AMD","BK4585","LU1267930813.SGD","BK4575","LU1852331112.SGD","BK4588","NVDA","LU0642271901.SGD"],"gpt_icon":1},{"id":"2574148431","title":"长川科技密集资本运作，发生了什么？","url":"https://stock-news.laohu8.com/highlight/detail?id=2574148431","media":"蓝鲸财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2574148431?lang=zh_cn&edition=fundamental","pubTime":"2025-10-10 09:24","pubTimestamp":1760059463,"startTime":"0","endTime":"0","summary":"2025年上半年，长川科技合同负债达6314万元，同比激增143.79%，下游客户的订单需求旺盛。矛盾交织在业绩利好推升股价的窗口期，长川科技实控人一致行动人的减持动作，引发了市场对“利好套现”的讨论。从减持时机与价格来看，长川投资的操作引发了市场对“时点精准性”的关注。对于长川科技而言，2025年下半年既是机遇期也是考验期。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.lanjinger.com/d/1759235121073461415","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"lanjinger_stock","symbols":["BK4588","SMH","SOXX","BK4585","SEMI"],"gpt_icon":1},{"id":"2574119973","title":"芯片设备，最新预测","url":"https://stock-news.laohu8.com/highlight/detail?id=2574119973","media":"半导体行业观察","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2574119973?lang=zh_cn&edition=fundamental","pubTime":"2025-10-10 08:51","pubTimestamp":1760057465,"startTime":"0","endTime":"0","summary":"国际半导体产业协会今日在其最新的《300毫米晶圆厂展望》中指出，预计2026年至2028年，全球300毫米晶圆厂设备支出将达到3740亿美元。预计2025年全球300毫米晶圆厂设备支出将首次超过1000亿美元，增长7%，达到1070亿美元。预计 2026 年至 2028 年，DRAM 相关设备投资将超过 790 亿美元，其中 3D NAND 投资将达到 560 亿美元。区域增长预计在国家自给自足政策的支持下，中国大陆将继续在 300 毫米设备支出方面保持领先地位，预计 2026 年至 2028 年的投资额将达到 940 亿美元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010085737a458ca1d&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010085737a458ca1d&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU1935042991.SGD","LU1623119135.USD","LU2247934214.USD","LU0965509010.AUD","LU2357305700.SGD","IE00BKVL7J92.USD","NVDS.UK","NVDU","LU2087621335.USD","LU1366333091.USD","LU1366192091.USD","LU1923622291.USD","NVDY","2NVD.UK","INTC","NVD3.UK","TSM","SEMI","LU0528227936.USD","SG9999014542.SGD","3NVD.UK","NVDX","IE00BHPRN162.USD","HK0000306701.USD","SMH","04335","SG9999000418.SGD","SNVD.UK","IE00B19Z8X17.USD","HBM","LU1069344957.HKD","NVD","SOXX","GAA","LU0061474705.USD","LU0081259029.USD","LU1934455277.USD","LU1244550494.USD","LU0211328371.USD","LU2065169927.USD","LU2028103732.USD","LU2125909916.SGD","NVD2.UK","NVDA","00981","NVIW.SI","NVDD","MU","SG9999002232.USD","IE0034235303.USD","04336","IE0004445015.USD","LU2420271590.USD","NVDS"],"gpt_icon":1},{"id":"2574189749","title":"陈立武：晶圆代工业务“增加三倍”","url":"https://stock-news.laohu8.com/highlight/detail?id=2574189749","media":"芯榜","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2574189749?lang=zh_cn&edition=fundamental","pubTime":"2025-10-09 11:55","pubTimestamp":1759982122,"startTime":"0","endTime":"0","summary":"鉴于近期人工智能领域主要参与者的进展，芯片制造商对晶圆厂设备的需求并不令人意外。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251009120606a6b16d84&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251009120606a6b16d84&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["LU0345769631.USD","IE00BDCRKT87.USD","LU2361044949.HKD","INTC","ORCL","LU1674673428.USD","LU0528227936.USD","LU0642271901.SGD","3NVD.UK","NVDD","LU1267930730.SGD","LU1366333091.USD","LU1914381329.SGD","LU1804176565.USD","LU1037948541.HKD","LU1983260115.SGD","LU2272731600.USD","NVD3.UK","NVD","NVDS","SG9999015986.USD","NVD2.UK","SG9999002232.USD","SEMI","2NVD.UK","LU1861559042.SGD","SOXX","LU2087621335.USD","NVDU","LU0823434583.USD","NVDS.UK","LU0345770993.USD","NVDY","LU0689472784.USD","LU1280957306.USD","SNVD.UK","SMH","LU2602419157.SGD","LU0094547139.USD","NVIW.SI","LU1674673691.USD","LU2272731865.HKD","LU2322448957.HKD","LU1127390331.HKD","NVDX","LU2272731782.SGD","LU1066053197.SGD","NVDA"],"gpt_icon":1},{"id":"2574690778","title":"美国晶圆厂投资，将超过中国大陆、中国台湾和韩国","url":"https://stock-news.laohu8.com/highlight/detail?id=2574690778","media":"半导体行业观察","labels":["economic"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2574690778?lang=zh_cn&edition=fundamental","pubTime":"2025-10-09 09:18","pubTimestamp":1759972684,"startTime":"0","endTime":"0","summary":"国际半导体产业协会  预测显示，随着人工智能需求的激增以及华盛顿推动本地化生产，美国半导体投资将从2027年起超过主要芯片经济体中国大陆、中国台湾和韩国。台积电已承诺在美国投资1650亿美元，而三星则在德克萨斯州投资超过400亿美元。美国顶级内存芯片制造商美光科技已承诺在美国本土投资2000亿美元，其中包括在爱达荷州、纽约州和弗吉尼亚州的多个项目。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251009092526a6b13fd7&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251009092526a6b13fd7&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"2","news_top_title":null,"news_tag":"economic","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["IE0009356076.USD","LU0823434583.USD","BK4534","BK4573","LU2250418816.HKD","BK4512","LU1861558580.USD","SEMI","LU0979878070.USD","SMH","LU0823434740.USD","LU1989764664.SGD","BK4532","BK4614","LU1951200564.SGD","LU2098885051.SGD","LU1852331112.SGD","LU0823421333.USD","BK4605","LU0390134368.USD","LU1064131342.USD","LU1880398471.USD","MU","BK4575","LU2054465674.USD","LU0109392836.USD","LU1242518857.USD","LU1861559042.SGD","LU2360106780.USD","LU2458330169.SGD","LU1316542783.SGD","LU0823421416.USD","LU1880398554.USD","BK4588","LU0198837287.USD","TSM","LU1303367103.USD","LU2458330243.SGD","LU0719512351.SGD","LU0127658192.USD","LU1923623000.USD","SOXX","BK4529","LU0056508442.USD","LU0889565833.HKD","LU0642271901.SGD","IE00BMPRXN33.USD","LU0081259029.USD","IE00B5949003.HKD","BK4554"],"gpt_icon":1},{"id":"2565742574","title":"联得半导体将携多款核心设备亮相深圳国际半导体展览会","url":"https://stock-news.laohu8.com/highlight/detail?id=2565742574","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2565742574?lang=zh_cn&edition=fundamental","pubTime":"2025-09-08 11:40","pubTimestamp":1757302806,"startTime":"0","endTime":"0","summary":null,"market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["00152","159546","SEMI","LU0880133367.SGD","BK1185","BK1507","LU1152091168.USD","159582","LU0067412154.USD","BK0152","BK1582","SG9999003461.SGD","300545","BK0251","LU1008478684.HKD","LU1152091754.HKD"],"gpt_icon":0}],"pageSize":20,"totalPage":1,"pageCount":1,"totalSize":14,"code":"91000000","status":"200"}]}}