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Columbia Select Technology ETF

30.42

0.0000

成交量：155.00

成交额：4,718.20

市值：3,726.22万

市盈率：- -

高：30.42

开：30.42

低：30.42

收：30.42

52周最高：33.77

52周最低：18.71

股本：122.50万

流通股本：122.50万

量比：0.23

换手率：0.01%

股息：1.37

股息率：4.52%

净资产收益率：--

总资产收益率：--

市净率：--

市盈率(LYR):- -

数据加载中...

总览公司新闻资讯公告

宜昌市猇亭区：“绿色智造”锻造现代化工新名片

中国新闻网

【湾区早参】香港最新失业率维持于3.8%；深圳瞪羚企业数首超伦敦

【财经早报】2025-12-18 星期四

【今日主题前瞻】一天一个价，存储芯片或迎以AI驱动的新一轮景气周期

存储芯片急单涌现，3D NAND代工“风口”属于谁？

21世纪经济报道

光刻胶新突破，资金加仓概念股出炉

未来三年，全球300毫米晶圆厂设备支出将突破3740亿美元

半导体新知道

SEMI：2025年全球300mm晶圆厂设备支出将首次超过1000亿美元

SEMI预测到2030年半导体市场将达到1万亿美元

电子产品世界

长川科技密集资本运作，发生了什么？

芯片设备，最新预测

半导体行业观察

陈立武：晶圆代工业务“增加三倍”

美国晶圆厂投资，将超过中国大陆、中国台湾和韩国

半导体行业观察

联得半导体将携多款核心设备亮相深圳国际半导体展览会

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13:54","pubTimestamp":1760162074,"startTime":"0","endTime":"0","summary":"SEMI预计2025年全球300mm晶圆厂设备支出将首次超过1000亿美元，增长7%，达到1070亿美元。SEMI报告预测，2026年投资将增长9%，达到1160亿美元；2027年增长4%，达到1200亿美元；2028年将增长15%，达到1380亿美元。模拟相关领域预计将在未来三年内投资超过410亿美元。按地区来看，中国大陆预计将继续领先全球300mm设备支出，2026至2028年间投资总额将达940亿美元。韩国预计将以860亿美元的投资额位居全球第二，支撑全球生成式AI需求。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251011135621a45a2913&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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11:07","pubTimestamp":1760065629,"startTime":"0","endTime":"0","summary":"根据SEMI的 300 毫米晶圆厂展望报告，到 2025 年，300 毫米晶圆厂设备的支出预计将达到 1070 亿美元。预计该行业今年将增长 7%，到 2026 年将增长 9%，达到 1160 亿美元，到 2027 年增长 4%，随后增长 15%，到 2028 年全球总支出将达到 1380 亿美元。未来三年，SEMI行业研究和统计总监Clark Tseng（如图）在亚利桑那州凤凰城的Semicon West发表讲话时说，未来三年的总支出将达到3740亿美元。半导体行业的周期性意味着增长率将逐渐减弱，但尽管如此，SEMI预计到 2030 年该行业的收入将超过 1 万亿美元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025101011071194c146ce&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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08:51","pubTimestamp":1760057465,"startTime":"0","endTime":"0","summary":"国际半导体产业协会今日在其最新的《300毫米晶圆厂展望》中指出，预计2026年至2028年，全球300毫米晶圆厂设备支出将达到3740亿美元。预计2025年全球300毫米晶圆厂设备支出将首次超过1000亿美元，增长7%，达到1070亿美元。预计 2026 年至 2028 年，DRAM 相关设备投资将超过 790 亿美元，其中 3D NAND 投资将达到 560 亿美元。区域增长预计在国家自给自足政策的支持下，中国大陆将继续在 300 毫米设备支出方面保持领先地位，预计 2026 年至 2028 年的投资额将达到 940 亿美元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010085737a458ca1d&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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