美股詳情

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Amerigas Partners L.P.

31.22

0.0000

成交量：- -

成交額：- -

市值：29.03億

市盈率：21.34

高：31.22

開：31.22

低：31.22

收：31.22

52周最高：41.00

52周最低：22.75

股本：9,299.97萬

流通股本：6,913.75萬

量比：- -

換手率：- -

股息：3.80

股息率：12.17%

每股收益(TTM):1.46

每股收益(LYR):1.54

淨資產收益率：31.53%

總資產收益率：5.73%

市淨率：6.63

市盈率(LYR):20.27

資料載入中...

總覽公司新聞資訊公告

AGESA的更新暗示9000G系列桌面APU即將推出

PConline太平洋...

AMD鋭龍9000G APU很快發布！但這也太弱了吧

快科技官方

AMD首顆客户端APU：Strix Halo詳解

半导体行业观察

超越 x86：AMD 確認將推出基於 ARM 架構的「Sound Wave」APU

Xbox Magnus APU規格曝光：48GB GDDR7顯存、110 TOPS AI算力

AI大佬自曝終極夢想是種地！

道氏技術：參股公司芯培森第二代APU產品研發正按計劃穩步推進

证券日报网

傳索尼PS6將搭載AMD定製Orion APU，性能最高達40 TFLOPS

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APU很快發布！但這也太弱了吧","url":"https://stock-news.laohu8.com/highlight/detail?id=2577829118","media":"快科技官方","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2577829118?lang=zh_tw&edition=fundamental","pubTime":"2025-10-21 11:21","pubTimestamp":1761016904,"startTime":"0","endTime":"0","summary":"快科技10月21日消息，AMD APU一直是广大劳动人民喜闻乐见的产品，不俗的性能和超高的性价比没法让人不爱，不过AMD似乎是越来越不在意了，毕竟利润实在太低。锐龙9000系列发布已久，锐龙9000G也终于快来了，但产品规格和性能可能会让大家有所失望。在此之前，我们一直以为锐龙9000G系列会基于主流移动版Strix Point，也就是锐龙AI 9 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x86：AMD 確認將推出基於 ARM 架構的「Sound Wave」APU","url":"https://stock-news.laohu8.com/highlight/detail?id=2575128338","media":"IT之家","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2575128338?lang=zh_tw&edition=fundamental","pubTime":"2025-10-13 23:27","pubTimestamp":1760369246,"startTime":"0","endTime":"0","summary":"IT之家 10 月 13 日消息，@Olrak29_ 发现，代号为“Sound Wave”的 AMD 处理器已经出现在了海关数据清单中，证实了该公司超越 x86 架构之外的处理器开发计划。@Moore's Law Is Dead 今年 3 月曾表示，“Sound Wave”采用了台积电 3nm 工艺，目标定位是 5~10W 的低功耗设备，预计 2026 年发布。相关阅读：《AMD \"Sound Wave\" Arm 架构 SoC 被曝为微软明年 Surface 设备设计》《AMD Arm 处理器“Sound Wave”最新爆料：台积电 3nm 工艺、2P + 4E 核，计划 2026 年发布》《AMD 未来 APU 前瞻：基于 Zen 6+RDNA 5 的 Sound Wave 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Magnus APU規格曝光：48GB GDDR7顯存、110 TOPS AI算力","url":"https://stock-news.laohu8.com/highlight/detail?id=2574911019","media":"DoNews","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2574911019?lang=zh_tw&edition=fundamental","pubTime":"2025-10-10 10:14","pubTimestamp":1760062442,"startTime":"0","endTime":"0","summary":"消息源 Moore's Law is Dead发布视频，展示微软下一代 Xbox 主机核心芯片“Magnus”APU 的完整规格。该主机代号为“Xbox Next”，搭载 AMD 定制的“Magnus”APU，计划于 2027 年推出，与索尼 PlayStation 6 展开竞争。“Magnus”APU 集成基于 RDNA 5 架构的 GPU，配备 68 个计算单元和至少 24MB L2 缓存。相比之下，PlayStation 6 的 GPU 预计为 52 至 54 个 RDNA 5 计算单元。新主机采用 192-bit 显存位宽，最高支持 48GB GDDR7 显存，超过传闻中 PS6 的 40GB 和 160-bit 配置。“Magnus”APU 采用双芯粒设计，总面积约 408mm，整机热设计功耗预计在250W 至 350W之间。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251010105904a458e9b9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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07:27","pubTimestamp":1759620473,"startTime":"0","endTime":"0","summary":"如果AI 真能胜任这项工作，对他而言将是一件值得庆幸的事。奥特曼表示，即便AI 接手部分工作，他仍可在OpenAI 担任其他角色。黄逸平表示，AI芯片厂英伟达投资入股英特尔，双方并将在产品方面展开合作，不过，英伟达并未提及与英特尔在制造方面的合作，同时强调台积电是重要合作伙伴。封杀中企子公司3.顶级AI大牛加入阿里通义！","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20251005072937a6ad5e56&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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17:39","pubTimestamp":1757669940,"startTime":"0","endTime":"0","summary":"证券日报网讯道氏技术（维权）9月12日发布公告，在公司回答调研者提问时表示，参股公司芯培森第二代APU产品研发正按计划稳步推进，预计今年底或明年初进行流片。\n\n\n海量资讯、精准解读，尽在新浪财经APP","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"sina","url":"https://finance.sina.com.cn/stock/relnews/cn/2025-09-12/doc-infqfstc0661104.shtml","rn_cache_url":null,"customStyle":"body{padding-top:10px;}.art_tit_h1{#titleStyle#}a{#lv2TextColor#}.art_time, .art_cite{#sourceStyle#;} .art_cite{margin-left: 3px;}","selectors":".module-article, article","filters":"header, .voice2, .tags, #norm_qrcode_link_auto, .unfold-box, 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6架构CPU与RDNA 5架构GPU，配备最高40GB GDDR7显存，理论算力达34-40 TFLOPS。新主机图形性能预计为PS5的2.5-3倍，光追性能提升最高达12倍，媲美NVIDIA RTX 5090显卡。系统还支持向下兼容PS5及PS4游戏，并计划于2027年秋季正式发售。结合FSR4或PSSR 2升频技术，整体性能可达PS5的4-8倍。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN202509121517389527e8b2&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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