美股詳情

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半導體精選

3,396.61

+148.474.57%

漲家數：15

跌家數：2

平家數：- -

市盈率：- -

高：3,417.76

開：3,251.90

低：3,251.90

收：3,248.13

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總覽新聞資訊

意法半導體4月29日成交額為1.31億美元

安森美半導體4月29日成交額為3.08億美元

恩智浦4月29日成交額為12.70億美元

美光科技4月29日成交額為13.19億美元

邁威爾科技4月29日成交額為8.72億美元

Galaxy Z Fold8 / Flip8 摺疊手機首發自家代工芯片，消息稱三星將承接高通部分 2nm 芯片訂單

英特爾4月29日成交額為14.39億美元

英特爾：18A製程節點今年將實現正式量產

美國超微公司4月29日成交額為19.94億美元

英特爾稱客戶即將試用其新生產流程

英特爾代工：Intel 18A製程節點已進入風險試產階段，將於今年量產

【星宸科技：AI眼鏡客戶終端產品預計下半年出貨】星宸科技在業績説明會上表示，公司在智能穿戴領域長期進行戰略佈局。目前已推出適用AI眼鏡的SoC芯片SSC309QL，客戶終端產品預計於2025年下半年出貨。同時正重點開發下一代適用於運動及智能穿戴場景的先進IP及SoC芯片，預計於2025年下半年投片。

【臺積電位於美國亞利桑那州的第三座晶圓廠近日破土】臺積電董事長兼總裁魏哲家在聲明中表示，臺積電計劃在美國引入更先進的半導體產能，該公司亞利桑那州的第三座晶圓廠最近破土。

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10:15","pubTimestamp":1745979345,"startTime":"0","endTime":"0","summary":"美东时间2025年4月29日，恩智浦成交额为12.70亿美元，成交额较昨日增加50.46%，当日成交量为695.08万股。恩智浦于2025年4月29日跌6.94%，报182.62美元，该股过去5个交易日涨4.56%，年初至今跌11.71%，过去60日跌12.0%。|近5个交易日成交情况||||#|日期|成交额（美元）|成交额较昨日变化|成交量（股）|#|2025-04-29|12.70亿|50.46%|695.08万|#|2025-04-28|8.44亿|76.64%|433.75万|#|2025-04-25|4.78亿|-41.47%|248.61万|#|2025-04-24|8.16亿|14.53%|424.72万|#|2025-04-23|7.13亿|42.03%|391.77万|恩智浦半导体公司是高性能混合信号产品的领先供应商。恩智浦半导体还为工业和物联网，移动和通信基础设施提供服务。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250430101553a6ce26fc&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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10:03","pubTimestamp":1745978635,"startTime":"0","endTime":"0","summary":"美东时间2025年4月29日，迈威尔科技成交额为8.72亿美元，成交额较昨日增加8.57%，当日成交量为1483.19万股。迈威尔科技于2025年4月29日跌0.03%，报58.68美元，该股过去5个交易日涨15.92%，年初至今跌46.79%，过去60日跌47.95%。|近5个交易日成交情况||||#|日期|成交额（美元）|成交额较昨日变化|成交量（股）|#|2025-04-29|8.72亿|8.57%|1483.19万|#|2025-04-28|8.03亿|15.65%|1384.00万|#|2025-04-25|6.95亿|-43.22%|1192.96万|#|2025-04-24|12.24亿|18.52%|2140.48万|#|2025-04-23|10.32亿|29.77%|1893.46万|美满电子科技有限公司是一家专注于有线网络的无晶圆厂芯片设计公司，在该领域拥有第二高的市场份额。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250430100357a6ce233e&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Z Fold8 / Flip8 摺疊手機首發自家代工芯片，消息稱三星將承接高通部分 2nm 芯片訂單","url":"https://stock-news.laohu8.com/highlight/detail?id=2531747001","media":"IT之家","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2531747001?lang=zh_tw&edition=fundamental","pubTime":"2025-04-30 09:53","pubTimestamp":1745978002,"startTime":"0","endTime":"0","summary":"IT之家 4 月 30 日消息，韩媒 sedaily 昨日发布博文，报道称三星晶圆代工业务重获高通青睐，将承接高通的 2nm 芯片生产订单。该媒体援引供应链消息，三星晶圆代工业务就 2 纳米移动应用处理器的生产细节，和高通公司展开协商，并推测在 2026 年下半年推出的Galaxy Z Fold8 和 Galaxy Z Flip8两款折叠旗舰手机中，率先装备三星代工的高通骁龙 8 至尊版 2 芯片，而明年的Galaxy S26系列所用芯片继续由台积电代工。这是时隔 3 年，三星公司再次为高通生产手机芯片。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025043009535094e8408c&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description 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