【英伟达披露下一代CPO技术 原型样品已就位】英伟达近日在SEMICON West 2026上公开展示了下一代共封装光学技术，名为OOI。不同于现有CPO方案，OOI选择拿下有机封装基板，将光引擎直接集成到承载GPU的硅中介层之上，把光电转换环节进一步向芯片内核靠拢，为下一代超大规模AI集群提供全新互联思路。据英伟达研究院首席研究科学家尼古拉•内多维奇介绍，该方案以更大面积的中介层取代现行有机封装基板，目前英伟达已拿到原型样品。
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