后摩智能完成数十亿元B轮融资,端侧大模型AI芯片进入规模化兑现期

格隆汇
6 hours ago
存算一体AI芯片企业后摩智能已于近期完成B轮融资,单笔融资金额高达数十亿元人民币,近一年内连续完成多轮融资。本轮融资上下游重磅产业资本集体押注、国有资本及国际投资人联袂入局,多家老股东持续加码,进一步印证了国内外资本市场对后摩智能技术路线与商业前景的高度认可。

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