ENG/中
老虎证券
市场
行情
24/7新闻
产品
Cash Boost账户
期权
A股通
港股
固定票息票据
美股
ETF
基金超市
美国国债
新加坡股
期货
Tiger BOSS Debit Card
老虎钱袋子
功能
经纪人
定投
CPF/SRS 投资
专栏
美股碎股
TigerAI
费用
综合账户
股票与ETF
期权、窝轮与牛熊证
期货
债券
基金超市
Cash Boost
股票与ETF
融资利率
活动
帮助
账户操作
如何开户
开户文件
账户类型
资金与转仓
入金
DDA快捷入金
出金
转入股票
转出股票
货币兑换
产品与交易
可交易产品
订单类型
交易规则
申报
融资融券
保证金与杠杆
风险管理
做空风险
基金超市
基金开户与交易
Cash Boost账户
Cash Boost 账户FAQ
如何开通 Cash Boost 账户
如何用Cash Boost 账户交易
如何绑定CDP证券账户
Tiger Boss Debit Card
常见问题
费用说明
如何充值
如何使用我的Debit card
账单报表
账单报表
股息(分红)
机构
Tiger Fund Management
机构服务
财富及资产管理人
自营交易机构
介绍经纪商
三方服务商
老虎API平台
登录
立即注册
Toggle
港股
详情
本页面由TTMF Limited提供服务
晶合集成
待上市
成交量:
- -
成交额:
- -
市值:
- -
市盈率:
- -
高:
- -
开:
- -
低:
- -
收:
- -
52周最高:
- -
52周最低:
- -
股本:
20.08亿
香港流通股本:
20.08亿
量比:
- -
换手率:
- -
股息:
- -
股息率:
- -
净资产收益率:
1.46%
总资产收益率:
0.74%
市净率:
0.00
市盈率(LYR):
- -
市销率:
0.00
1
开始申购
06/30
2
申购截止
07/07 10:15
3
公布中签
07/08
4
暗盘
07/09 16:15 - 18:30
5
挂牌上市
07/10
总览
公司
新闻
公告
价格范围
30.00 ~ 32.30 HKD
发行价
- -
发行量
2.16亿
预计市值
667.13亿 ~ 718.27亿 HKD
最低申购数量
100
承销商
中国国际金融香港证券有限公司
查看招股说明书
新闻
A股MCU概念板块异动拉升
智通财经
·
4小时前
科创50日内涨幅达1.00%,成分股中,传音控股涨7.91%,国博电子涨7.17%,晶合集成涨6.67%,源杰科技涨5.
智通财经
·
7小时前
科创50探底回升翻红
智通财经
·
8小时前
新股招股 | 晶合集成今起招股,一手入场费3262.57港元
老虎资讯综合
·
06/30
{"basename":"/hans","ssrTDKData":{"titleTemplate":"%s - 老虎证券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股,新股,港股,A股等全球金融理财产品。新加坡华人最信赖的在线投资平台,现在加入即享低费用,24/5 无时差炒美股投资理财!","keywords":"老虎证券,老虎证券开户,老虎券商,老虎证券官网,老虎证券app,tigertrade老虎证券,股票,炒股,新加坡股票交易平台,投资,投资理财","social":{"ogDescription":"老虎证券助您一站式投资美股,新股,港股,A股等全球金融理财产品。新加坡华人最信赖的在线投资平台,现在加入即享低费用,24/5 无时差炒美股投资理财!","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hans/stock/02249"},"companyName":"老虎证券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental","symbol":"02249","isAnalysisPage":false},"__swrFallback__":{"@#url:\"https://hq.skytigris.cn/stock_info/detail/global\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"02249\",,,,,undefined,":{"symbol":"02249","market":"HK","secType":"STK","nameCN":"晶合集成","latestPrice":0,"timestamp":1783065600000,"preClose":0,"halted":7,"volume":0,"delay":0,"floatShares":2007999999,"shares":2007999999,"eps":0,"marketStatus":"待上市","change":0,"latestTime":"07-03 16:00:00","open":0,"high":0,"low":0,"amount":0,"amplitude":0,"askPrice":0,"askSize":0,"bidPrice":0,"bidSize":0,"shortable":3,"etf":0,"ttmEps":0,"tradingStatus":0,"nextMarketStatus":{"tag":"开盘","tradingStatus":2,"beginTime":1783647000000},"marketStatusCode":8,"adr":0,"listingDate":1783612800000,"exchange":"SEHK","adjPreClose":0,"openAndCloseTimeList":[[1783042200000,1783051200000],[1783054800000,1783065600000]],"volumeRatio":0,"ipoDetail":{"name":"晶合集成","exchange":"SEHK","listingDate":"2026-07-10","sharesOutstanding":2223758697,"sharesFloat":2223758697,"offerAmount":216167000,"priceRange":"30.000 - 32.300","market":"HK","openProspectusDate":"2026-06-30","openProspectusUrl":"https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0630/2026063000124_c.pdf","purchaseBeginDate":"2026-06-30","purchaseEndDate":"2026-07-07","winningDate":"2026-07-09","currency":"HKD","minPurchaseQuantity":100,"peRate":89,"use":"1、约53.6%或3,503.2百万港元将用于研发及优化新一代22nm技术平台,以加强公司的技术竞争力及满足市场对高性能产品的需求;\n2、约23.1%或1,509.7百万港元将用于基于AI技术的智能研发及生产计划;\n3、约13.3%或869.2百万港元将用于在中国香港建立研发及销售中心,以开展研发及销售活动;\n4、约10.0%或653.5百万港元将用于运营资金及一般企业用途。","industryId":"210003","industryName":"半导体","business":"公司是一家领先的12英寸纯晶圆代工企业,处于全球半导体价值链的关键环节。作为专业的晶圆代工服务供应商,代工企业将无晶圆、轻晶圆及垂直整合制造(「IDM」)公司的集成电路设计蓝图大规模地制成高品质的加工晶圆。","subscribed":2.83,"marketCap":66713000000,"minimumCapital":3262.57,"overAllotment":true,"lotSize":100,"issueOpenRate":0.1,"subscribeGear":"100,200,300,400,500,600,700,800,900,1000,2000,3000,4000,5000,6000,7000,8000,9000,10000,20000,30000,40000,50000,60000,70000,80000,90000,100000,200000,300000,400000,500000,1000000,1500000,2000000,3000000,4000000,6000000,8000000,10808300","issueRatio":0.1,"offeringMechanism":"B"},"greyMarketDetail":{"greyDate":"2026-07-09","greyDateTimestamp":1783526400000,"greyOpeningTime":1783584900000,"greyClosingTime":1783593000000,"showGreyQuote":false,"openProspectusDate":"2026-06-30","listingDate":"2026-07-10"},"lotSize":100,"spreadScale":0,"tradeCurrency":"HKD","astockBrief":{"symbol":"688249","market":"SH","secType":"STK","nameCN":"晶合集成","latestPrice":61.1,"timestamp":1783062000000,"preClose":60.43,"halted":0,"volume":79669000,"delay":0,"premium":"-100.00"}},"@#url:\"https://hq.skytigris.cn/stock_info/fundamental/all\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"02249\",,,,,undefined,":{"symbol":"02249","floatShares":2007999999,"roa":"0.74%","roe":"1.46%","lyrEps":0,"shares":2007999999,"dividePrice":0,"high":0,"amplitude":0,"preClose":0,"low":0,"week52Low":0,"pbRate":"0.00","psRate":"0.00","week52High":0,"institutionHeld":0,"latestPrice":0,"eps":0,"divideRate":0,"volume":0,"delay":0,"ttmEps":0,"open":0},"@#url:\"https://hktrade.skytigris.com/ipos/general/02249\",,undefined,":{"id":10428,"type":"COMMON","ipoName":"02249-IPO","symbol":"02249","companyName":"晶合集成","market":"HK","currency":"HKD","status":"OPEN","underwriter":"中国国际金融香港证券有限公司","lotSize":100,"minQty":100,"expectedOfferingSize":216167000,"openingDate":1782783000000,"closingDate":1783390500000,"commonClosingDate":1783390500000,"allotmentDate":1783440000000,"listDate":1783612800000,"marginable":true,"marginRate":10,"latestPrice":32.3,"minPrice":30,"maxPrice":32.3,"prospectusUrl":"https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0630/2026063000124_c.pdf","allowedQuantities":[100,200,300,400,500,600,700,800,900,1000,2000,3000,4000,5000,6000,7000,8000,9000,10000,20000,30000,40000,50000,60000,70000,80000,90000,100000,200000,300000,400000,500000,1000000,1500000,2000000,3000000,4000000,6000000,8000000,10808300],"interestRate":0,"recommend":false,"isHint":false,"interestStartDate":1783353600000,"interestEndDate":1783353600000,"delayAllocate":false,"isSupportGreyMarket":true,"greyMarketTradeDate":1783584900000,"transactionRate":0.010085,"gstFeeRate":0,"rank":0,"subscribed":false,"signed":false,"financingInfos":[{"ipoName":"02249-IPO","ipoId":10428,"financingId":61731,"type":1,"availableFundLimit":3262.57,"piAvailableAmountLimit":0,"piMaxAvailableAmountLimit":-1,"piMinSubscribeAmount":0,"piMaxSubscribeAmount":-1,"minSubscribeLimit":32625.7,"maxSubscribeLimit":-1,"marginRate":10,"interestRate":0,"openTime":1782783000000,"closeTime":1783390500000,"isAtValidTime":true,"subscriptionMethod":"FINANCING","processFee":0,"supportPI":false,"applyFundLimit":3262.57,"threshold":50000000000,"isAvailable":false},{"ipoName":"02249-IPO","ipoId":10428,"financingId":61724,"type":4,"availableFundLimit":3262.57,"piAvailableAmountLimit":0,"piMaxAvailableAmountLimit":-1,"piMinSubscribeAmount":0,"piMaxSubscribeAmount":-1,"minSubscribeLimit":0,"maxSubscribeLimit":-1,"marginRate":100,"interestRate":0,"openTime":1782783000000,"closeTime":1783390500000,"isAtValidTime":true,"subscriptionMethod":"CASH","processFee":0,"supportPI":false,"applyFundLimit":3262.57,"threshold":50000000000,"isAvailable":false}],"financingNotifyEnabled":false,"financingNotifySubscribed":false,"subscriptionMethods":[{"method":"FINANCING","closeTime":1783390500000,"available":false,"messageCode":"AVAILABLE_FUND_LIMIT","minAvailableFundLimit":3262.57},{"method":"CASH","closeTime":1783390500000,"available":false,"messageCode":"AVAILABLE_FUND_LIMIT","minAvailableFundLimit":3262.57}],"latestClosingDate":1783390500000,"subscribedFinanceRatio":2.83,"subscribedRatio":2.83,"forecastRatio":4.75,"raiseMoney":698220000,"totalMargin":1977860000,"quoteInfoUpdatedAt":1783072361057,"prospectusUpdatedAt":1783044519000,"forecastMarketValue":69270083411.55,"minForecastMarketValue":66712760910,"maxForecastMarketValue":71827405913.09999,"sharesOutstanding":2223758697,"business":"公司是一家领先的12英寸纯晶圆代工企业,处于全球半导体价值链的关键环节。作为专业的晶圆代工服务供应商,代工企业将无晶圆、轻晶圆及垂直整合制造(「IDM」)公司的集成电路设计蓝图大规模地制成高品质的加工晶圆。","greyOpeningTime":1783584900000,"greyClosingTime":1783593000000,"tradable":true,"showClawback":true,"clawbackType":"机制B","clawbackRate":10},"$inf$@#url:\"https://stock-news.skytigris.cn/v2/news/list\",params:#symbols:\"02249\",pageSize:4,pageCount:1,lang_content:\"cn\",edition:\"fundamental\",,,undefined,":[{"items":[{"id":"2648653680","title":"A股MCU概念板块异动拉升","url":"https://stock-news.laohu8.com/highlight/detail?id=2648653680","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648653680?lang=zh_cn&edition=fundamental","pubTime":"2026-07-03 13:01","pubTimestamp":1783054861,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2648630357","title":"科创50日内涨幅达1.00%,成分股中,传音控股涨7.91%,国博电子涨7.17%,晶合集成涨6.67%,源杰科技涨5.","url":"https://stock-news.laohu8.com/highlight/detail?id=2648630357","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648630357?lang=zh_cn&edition=fundamental","pubTime":"2026-07-03 10:53","pubTimestamp":1783047184,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2648632414","title":"科创50探底回升翻红","url":"https://stock-news.laohu8.com/highlight/detail?id=2648632414","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648632414?lang=zh_cn&edition=fundamental","pubTime":"2026-07-03 09:44","pubTimestamp":1783043097,"startTime":"0","endTime":"0","summary":null,"market":"hk","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.zhitongcaijing.com/immediately.html?type=usstock","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_zhitongcaijing","symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1169199821","title":"新股招股 | 晶合集成今起招股,一手入场费3262.57港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1169199821","media":"老虎资讯综合","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1169199821?lang=zh_cn&edition=fundamental","pubTime":"2026-06-30 08:57","pubTimestamp":1782781066,"startTime":"0","endTime":"0","summary":"6月30日,晶合集成发布公告,公司拟全球发售约2.16亿股H股,中国香港发售2161.67万股H股,国际发售约1.95亿股H股;2026年6月30日至7月7日招股,预期定价日为7月8日;发售价将为每股发售股份30.00港元-32.30港元,H股的每手买卖单位将为100股,中金公司为独家保荐人;预期H股将于2026年7月10日开始于联交所买卖。假设发售价为每股发售股份31.15港元,并假设超额配股权未获行使,公司估计将从全球发售中收取所得款项净额约65.356亿港元。","market":"hk","thumbnail":"https://static.tigerbbs.com/0bc9411b92daca5fa6f9496d92394df3","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/0bc9411b92daca5fa6f9496d92394df3"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"新股招股 | 晶合集成今起招股,一手入场费3262.57港元","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":4,"totalPage":4,"pageCount":1,"totalSize":13,"code":"91000000","status":"200"}]}}