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晶合集成
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1
开始申购
06/30
2
申购截止
07/07 10:15
3
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07/08
4
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07/09 16:15 - 18:30
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07/10
总览
公司
新闻
公告
A股MCU概念板块异动拉升
智通财经
·
6小时前
科创50日内涨幅达1.00%,成分股中,传音控股涨7.91%,国博电子涨7.17%,晶合集成涨6.67%,源杰科技涨5.
智通财经
·
8小时前
科创50探底回升翻红
智通财经
·
9小时前
新股招股 | 晶合集成今起招股,一手入场费3262.57港元
老虎资讯综合
·
06/30
晶合集成(02249)6月30日至7月7日招股 拟全球发售2.16亿股H股 引入集创、璞新科技等基石投资者
智通财经
·
06/30
晶合集成(688249.SH):H股发行价格最高不超过每股32.30港元
智通财经
·
06/30
新股快讯:合肥晶合集成电路(02249)启动全球发售,最高发售价每股32.30港元
公告速递
·
06/30
晶合集成获得实用新型专利授权:“一种半导体薄膜沉积设备”
证券之星
·
06/16
770亿合肥芯片“黑马”晶合集成冲刺港股IPO:增收不增利,净利润大幅下滑62.61%、净利率不足1%
市场资讯
·
06/11
又一半导体巨头要登陆港交所了
华尔街见闻
·
06/09
晶合集成通过聆讯:第一季营收29亿 净利同比降63% 华勤技术持股11%
雷递网
·
06/08
新股消息 | 晶合集成(688249.SH)通过港交所聆讯 2025年12英寸晶圆的平均月产量为139千片
智通财经
·
06/08
晶合集成赴港IPO,专注于12英寸晶圆代工,全球第九!
格隆汇
·
06/01
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08:57","pubTimestamp":1782781066,"startTime":"0","endTime":"0","summary":"6月30日,晶合集成发布公告,公司拟全球发售约2.16亿股H股,中国香港发售2161.67万股H股,国际发售约1.95亿股H股;2026年6月30日至7月7日招股,预期定价日为7月8日;发售价将为每股发售股份30.00港元-32.30港元,H股的每手买卖单位将为100股,中金公司为独家保荐人;预期H股将于2026年7月10日开始于联交所买卖。假设发售价为每股发售股份31.15港元,并假设超额配股权未获行使,公司估计将从全球发售中收取所得款项净额约65.356亿港元。","market":"hk","thumbnail":"https://static.tigerbbs.com/0bc9411b92daca5fa6f9496d92394df3","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/0bc9411b92daca5fa6f9496d92394df3"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":"新股招股 | 晶合集成今起招股,一手入场费3262.57港元","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647683583","title":"晶合集成(02249)6月30日至7月7日招股 拟全球发售2.16亿股H股 引入集创、璞新科技等基石投资者","url":"https://stock-news.laohu8.com/highlight/detail?id=2647683583","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2647683583?lang=zh_cn&edition=fundamental","pubTime":"2026-06-30 08:23","pubTimestamp":1782779027,"startTime":"0","endTime":"0","summary":"智通财经APP讯,晶合集成 2026年6月30日至2026年7月7日招股,该公司拟全球发售2.16亿股H股,其中,香港公开发售占约10%,国际发售占约90%,另有15%超额配股权。每股发售价30-32.3港元。预期所得款项净额约23.1%将用于基于AI技术的智能研发及生产。于2023年、2024年及2025年,净利润分别为人民币1.19亿元、人民币4.82亿元及人民币4.67亿元,同年净利润率分别为1.7%、5.3%及4.5%。","market":"hk","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460877.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["688249","02249","IPOS","BK0214"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647588799","title":"晶合集成(688249.SH):H股发行价格最高不超过每股32.30港元","url":"https://stock-news.laohu8.com/highlight/detail?id=2647588799","media":"智通财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2647588799?lang=zh_cn&edition=fundamental","pubTime":"2026-06-30 08:10","pubTimestamp":1782778235,"startTime":"0","endTime":"0","summary":"智通财经APP讯,晶合集成 发布公告,公司本次全球发售H股基础发行股数为2.16亿股,其中,初步安排香港公开发售2161.67万股,约占全球发售总数的10%;国际发售1.95亿股,约占全球发售总数的90%。在超额配售权悉数行使的情况下,公司本次全球发售H股的最大发行股数为2.49亿股。公司本次H股发行的价格最高不超过每股32.30港元。公司本次发行的H股预计于2026年7月10日在香港联交所挂牌并开始上市交易。","market":"fut","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460863.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["02249","BK0214","688249","EWH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1149704431","title":"新股快讯:合肥晶合集成电路(02249)启动全球发售,最高发售价每股32.30港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1149704431","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1149704431?lang=zh_cn&edition=fundamental","pubTime":"2026-06-30 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数据显示,截至最新收盘,晶合集成股价报38.41元/股,总市值771亿元。自6月以来,公司股价累计下跌超15%。公司一季度实现营收29.12亿元,同比增长13.42%,但归母净利润仅5066万元,同比下滑62.61%,整体净利率不足1%。尽管占比逐年回落,但2025年该项业务占比仍高达58.06%,依旧是晶合集成最核心的收入支","market":"fut","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://finance.sina.com.cn/wm/2026-06-11/doc-iniaysmc0936650.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"sina","symbols":["BK0214","02249","688249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2642454843","title":"又一半导体巨头要登陆港交所了","url":"https://stock-news.laohu8.com/highlight/detail?id=2642454843","media":"华尔街见闻","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2642454843?lang=zh_cn&edition=fundamental","pubTime":"2026-06-09 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23:06","pubTimestamp":1780931207,"startTime":"0","endTime":"0","summary":"合肥晶合集成电路股份有限公司(简称“晶合集成”)日前通过上市聆讯,准备在港交所上市。","market":"us","thumbnail":"https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20260608/6391655679758032434882325.jpeg","type":0,"news_type":0,"thumbnails":["https://leidinews-1256465536.cos.ap-chengdu.myqcloud.com/u_News/20260608/6391655679758032434882325.jpeg"],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.leinews.com/n33964/detail.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"leinews_highlight","symbols":["02249","603296","688249","03296"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2641486376","title":"新股消息 | 晶合集成(688249.SH)通过港交所聆讯 2025年12英寸晶圆的平均月产量为139千片","url":"https://stock-news.laohu8.com/highlight/detail?id=2641486376","media":"智通财经","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2641486376?lang=zh_cn&edition=fundamental","pubTime":"2026-06-08 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