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晶合集成

30.880

+0.3801.25%

成交量：100.86万

成交额：3,145.81万

市值：690.17亿

市盈率：77.08

高：31.940

开：30.520

低：30.500

收：30.500

52周最高：37.000

52周最低：27.700

股本：22.35亿

香港流通股本：2.27亿

量比：0.42

换手率：0.44%

股息：- -

股息率：- -

每股收益(LYR):0.401

净资产收益率：1.46%

总资产收益率：0.74%

市净率：2.70

市盈率(LYR):77.08

市销率: 5.27

数据加载中...

总览公司新闻资讯公告

财报前瞻｜晶合集成本季度营收预计增23.05%，机构观点偏多

异动解读｜晶合集成盘中下跌3.43%，日本特气出口管制落地叠加半导体板块集体回调

异动解读｜晶合集成盘中上涨3.06%，中期业绩发布在即叠加半导体板块走强

异动解读｜晶合集成盘中上涨3.41%，中期业绩发布在即叠加半导体龙头带动

异动解读｜晶合集成盘中上涨3.33%，半导体板块持续反弹叠加港股通资金承接

晶合集成（02249）拟于8月24日召开董事会审议2026年中期业绩及分红事宜

异动解读｜晶合集成盘中上涨3.43%，半导体板块集体反弹叠加超额配售消化顺利

晶合集成(02249)超额配售稀释华勤系持股比例至10.98%

晶合集成部分行使超额配股权发行约1088.69万股H股

晶合集成(02249.HK)因超额配股权获部分行使而发行1088.69万股

异动解读｜晶合集成盘中上涨3.16%，超额配售股份上市首日获多方资金承接

异动解读｜晶合集成盘中下跌3.05%，半导体板块集体走弱叠加超额配售股份即将上市

港股异动 | 晶合集成升逾4%，今起正式进入港股通，公司聚焦12英寸晶圆代工业务

异动解读｜晶合集成盘中上涨3.14%，获调入港股通标的名单今日生效

港股通标的证券名单调入晶合集成，今日起生效

老虎资讯综合

晶合集成(02249.HK)获调入沪深港通下的港股通标的名单

深交所公告，港股通标的证券名单调入晶合集成，自2026年08月07日起生效。

晶合集成(02249.HK)超额配股权获部分行使额外筹3.45亿元

阿斯达克财经

晶合集成(02249.HK)：部分行使超额配股权、稳定价格行动及稳定价格期结束

晶合集成局部行使超额配股权筹资约3.45亿港元 H股占比升至10.16%

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13:39","pubTimestamp":1786685964,"startTime":"0","endTime":"0","summary":"8月14日，晶合集成盘中上涨3.41%，报35.16港元/股，成交额5674.59万港元。消息面上，公司董事会定于8月24日召开会议，审议截至6月30日止六个月的中期业绩并考虑派发中期股息，业绩窗口临近催化市场情绪。同业中芯国际当日涨6.66%，半导体板块龙头持续走强带动行业热度。此外，公司8月7日纳入港股通标的后，叠加GIC增持至5.30%、华勤技术增持至11.03%等机构资金持续入场，为股价提供资金面支撑。（以上内容均基于市场公开消息，由程序或算法智能生成，仅作为股价异动提醒，不作为投资建议或交易依据。）","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1153608159","title":"异动解读｜晶合集成盘中上涨3.33%，半导体板块持续反弹叠加港股通资金承接","url":"https://stock-news.laohu8.com/highlight/detail?id=1153608159","media":"行情直击","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1153608159?lang=zh_cn&edition=fundamental","pubTime":"2026-08-13 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21:55","pubTimestamp":1786024536,"startTime":"0","endTime":"0","summary":"2026年8月6日，合肥晶合集成电路股份有限公司公告称，整体协调人已于同日部分行使超额配股权，认购股份数为10,886,900股H股，占全球发售项下初步可供认购发售股份总数约5.04%。上述股份的发行价为每股32.30港元，不含1.0%经纪佣金、0.0027%证监会交易征费、0.00015%会财局交易征费及0.00565%联交所交易费。部分行使超额配股权后，公司已发行股本由2,223,758,697股增至2,234,645,597股。未被行使的超额配股权已于2026年8月6日失效。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"SGX","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["02249"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":7,"pageCount":1,"totalSize":131,"code":"91000000","status":"200"}]}}