ENG/中
老虎证券
市场
行情
24/7新闻
产品
Cash Boost账户
期权
A股通
港股
固定票息票据
美股
ETF
基金超市
美国国债
新加坡股
期货
Tiger BOSS Debit Card
老虎钱袋子
功能
经纪人
定投
CPF/SRS 投资
专栏
美股碎股
TigerAI
费用
综合账户
股票与ETF
期权、窝轮与牛熊证
期货
债券
基金超市
Cash Boost
股票与ETF
融资利率
活动
帮助
账户操作
如何开户
开户文件
账户类型
资金与转仓
入金
DDA快捷入金
出金
转入股票
转出股票
货币兑换
产品与交易
可交易产品
订单类型
交易规则
申报
融资融券
保证金与杠杆
风险管理
做空风险
基金超市
基金开户与交易
Cash Boost账户
Cash Boost 账户FAQ
如何开通 Cash Boost 账户
如何用Cash Boost 账户交易
如何绑定CDP证券账户
Tiger Boss Debit Card
常见问题
费用说明
如何充值
如何使用我的Debit card
账单报表
账单报表
股息(分红)
机构
Tiger Fund Management
机构服务
财富及资产管理人
自营交易机构
介绍经纪商
三方服务商
老虎API平台
登录
立即注册
Toggle
港股
详情
本页面由TTMF Limited提供服务
晶合集成
待上市
成交量:
- -
成交额:
- -
市值:
- -
市盈率:
- -
高:
- -
开:
- -
低:
- -
收:
- -
52周最高:
- -
52周最低:
- -
股本:
20.08亿
香港流通股本:
20.08亿
量比:
- -
换手率:
- -
股息:
- -
股息率:
- -
净资产收益率:
1.46%
总资产收益率:
0.74%
市净率:
0.00
市盈率(LYR):
- -
市销率:
0.00
1
开始申购
06/30
2
申购截止
07/07 10:15
3
公布中签
07/08
4
暗盘
07/09 16:15 - 18:30
5
挂牌上市
07/10
总览
公司
新闻
公告
公司资料
公司名字:
晶合集成
交易所:
SEHK
成立时间:
- -
员工人数:
- -
公司地址:
- -
官网:
- -
邮编:
- -
电话:
- -
传真:
- -
简介:
公司前身系合肥晶合集成电路有限公司,2015年5月设立。主要从事12英寸晶圆代工业务,致力于研发及应用行业先进的工艺,为客户提供不同工艺平台、多种制程节点的晶圆代工服务。主要产品为显示驱动芯片(DDIC)、CMOS图像传感器芯片(CIS)、电源管理芯片(PMIC)、微控制器芯片(MCU)、逻辑芯片(Logic)等。
董事
名称
职位
蔡国智
董事长,董事,战略与ESG委员会主任委员,战略与ESG委员会委员
陆勤航
副董事长,董事,薪酬与考核委员会委员
陈小蓓
董事,提名委员会委员
郭兆志
董事,审计委员会委员
朱才伟
职工董事,联席公司秘书,授权代表,战略与ESG委员会委员
邱文生
董事,战略与ESG委员会委员
安广实
独立董事,提名委员会委员,审计委员会主任委员,审计委员会委员
蔺智挺
独立董事,薪酬与考核委员会委员,提名委员会主任委员,提名委员会委员
陈铤
独立董事,薪酬与考核委员会主任委员,薪酬与考核委员会委员,审计委员会委员
曹宗野
证券事务代表
叶翠媚
联席公司秘书,授权代表
邱显寰
核心技术人员
张伟墐
核心技术人员
李庆民
核心技术人员
郑志成
核心技术人员
股东
名称
职位
郑志成
联席总经理
邱显寰
联席总经理
蔡国智
代总经理
朱晓娟
副总经理
朱才伟
副总经理,财务负责人,董事会秘书
周义亮
副总经理
{"basename":"/hans","ssrTDKData":{"titleTemplate":"%s - 老虎证券","title":"老虎证券全球投资理财平台| 一站式投资美股新股港股A股","description":"老虎证券助您一站式投资美股,新股,港股,A股等全球金融理财产品。新加坡华人最信赖的在线投资平台,现在加入即享低费用,24/5 无时差炒美股投资理财!","keywords":"老虎证券,老虎证券开户,老虎券商,老虎证券官网,老虎证券app,tigertrade老虎证券,股票,炒股,新加坡股票交易平台,投资,投资理财","social":{"ogDescription":"老虎证券助您一站式投资美股,新股,港股,A股等全球金融理财产品。新加坡华人最信赖的在线投资平台,现在加入即享低费用,24/5 无时差炒美股投资理财!","ogImage":"https://c1.itigergrowtha.com/portal5/static/media/og-logo.be62fbe1.png","ogUrl":"https://www.itiger.com/hans/stock/02249/company"},"companyName":"老虎证券"},"pageData":{"isMobile":false,"isTiger":false,"isTTM":true,"region":"SGP","license":"TBSG","edition":"fundamental","symbol":"02249","isAnalysisPage":false},"__swrFallback__":{"@#url:\"https://hq.skytigris.cn/stock_info/detail/global\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"02249\",,,,,undefined,":{"symbol":"02249","market":"HK","secType":"STK","nameCN":"晶合集成","latestPrice":0,"timestamp":1783065600000,"preClose":0,"halted":7,"volume":0,"delay":0,"floatShares":2007999999,"shares":2007999999,"eps":0,"marketStatus":"待上市","change":0,"latestTime":"07-03 16:00:00","open":0,"high":0,"low":0,"amount":0,"amplitude":0,"askPrice":0,"askSize":0,"bidPrice":0,"bidSize":0,"shortable":3,"etf":0,"ttmEps":0,"tradingStatus":0,"nextMarketStatus":{"tag":"开盘","tradingStatus":2,"beginTime":1783647000000},"marketStatusCode":8,"adr":0,"listingDate":1783612800000,"exchange":"SEHK","adjPreClose":0,"openAndCloseTimeList":[[1783042200000,1783051200000],[1783054800000,1783065600000]],"volumeRatio":0,"ipoDetail":{"name":"晶合集成","exchange":"SEHK","listingDate":"2026-07-10","sharesOutstanding":2223758697,"sharesFloat":2223758697,"offerAmount":216167000,"priceRange":"30.000 - 32.300","market":"HK","openProspectusDate":"2026-06-30","openProspectusUrl":"https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0630/2026063000124_c.pdf","purchaseBeginDate":"2026-06-30","purchaseEndDate":"2026-07-07","winningDate":"2026-07-09","currency":"HKD","minPurchaseQuantity":100,"peRate":89,"use":"1、约53.6%或3,503.2百万港元将用于研发及优化新一代22nm技术平台,以加强公司的技术竞争力及满足市场对高性能产品的需求;\n2、约23.1%或1,509.7百万港元将用于基于AI技术的智能研发及生产计划;\n3、约13.3%或869.2百万港元将用于在中国香港建立研发及销售中心,以开展研发及销售活动;\n4、约10.0%或653.5百万港元将用于运营资金及一般企业用途。","industryId":"210003","industryName":"半导体","business":"公司是一家领先的12英寸纯晶圆代工企业,处于全球半导体价值链的关键环节。作为专业的晶圆代工服务供应商,代工企业将无晶圆、轻晶圆及垂直整合制造(「IDM」)公司的集成电路设计蓝图大规模地制成高品质的加工晶圆。","subscribed":4.02,"marketCap":66713000000,"minimumCapital":3262.57,"overAllotment":true,"lotSize":100,"issueOpenRate":0.1,"subscribeGear":"100,200,300,400,500,600,700,800,900,1000,2000,3000,4000,5000,6000,7000,8000,9000,10000,20000,30000,40000,50000,60000,70000,80000,90000,100000,200000,300000,400000,500000,1000000,1500000,2000000,3000000,4000000,6000000,8000000,10808300","issueRatio":0.1,"offeringMechanism":"B"},"greyMarketDetail":{"greyDate":"2026-07-09","greyDateTimestamp":1783526400000,"greyOpeningTime":1783584900000,"greyClosingTime":1783593000000,"showGreyQuote":false,"openProspectusDate":"2026-06-30","listingDate":"2026-07-10"},"lotSize":100,"spreadScale":0,"tradeCurrency":"HKD","astockBrief":{"symbol":"688249","market":"SH","secType":"STK","nameCN":"晶合集成","latestPrice":61.1,"timestamp":1783062000000,"preClose":60.43,"halted":0,"volume":79669000,"delay":0,"premium":"-100.00"}},"@#url:\"https://hq.skytigris.cn/stock_info/fundamental/all\",params:#delay:false,,method:\"POST\",data:#items:@#symbol:\"02249\",,,,,undefined,":{"symbol":"02249","floatShares":2007999999,"roa":"0.74%","roe":"1.46%","lyrEps":0,"shares":2007999999,"dividePrice":0,"high":0,"amplitude":0,"preClose":0,"low":0,"week52Low":0,"pbRate":"0.00","psRate":"0.00","week52High":0,"institutionHeld":0,"latestPrice":0,"eps":0,"divideRate":0,"volume":0,"delay":0,"ttmEps":0,"open":0},"@#url:\"https://hktrade.skytigris.com/ipos/general/02249\",,undefined,":{"id":10428,"type":"COMMON","ipoName":"02249-IPO","symbol":"02249","companyName":"晶合集成","market":"HK","currency":"HKD","status":"OPEN","underwriter":"中国国际金融香港证券有限公司","lotSize":100,"minQty":100,"expectedOfferingSize":216167000,"openingDate":1782783000000,"closingDate":1783390500000,"commonClosingDate":1783390500000,"allotmentDate":1783440000000,"listDate":1783612800000,"marginable":true,"marginRate":10,"latestPrice":32.3,"minPrice":30,"maxPrice":32.3,"prospectusUrl":"https://www1.hkexnews.hk/listedco/listconews/sehk/2026/0630/2026063000124_c.pdf","allowedQuantities":[100,200,300,400,500,600,700,800,900,1000,2000,3000,4000,5000,6000,7000,8000,9000,10000,20000,30000,40000,50000,60000,70000,80000,90000,100000,200000,300000,400000,500000,1000000,1500000,2000000,3000000,4000000,6000000,8000000,10808300],"interestRate":0,"recommend":false,"isHint":false,"interestStartDate":1783353600000,"interestEndDate":1783353600000,"delayAllocate":false,"isSupportGreyMarket":true,"greyMarketTradeDate":1783584900000,"transactionRate":0.010085,"gstFeeRate":0,"rank":0,"subscribed":false,"signed":false,"financingInfos":[{"ipoName":"02249-IPO","ipoId":10428,"financingId":61731,"type":1,"availableFundLimit":3262.57,"piAvailableAmountLimit":0,"piMaxAvailableAmountLimit":-1,"piMinSubscribeAmount":0,"piMaxSubscribeAmount":-1,"minSubscribeLimit":32625.7,"maxSubscribeLimit":-1,"marginRate":10,"interestRate":0,"openTime":1782783000000,"closeTime":1783390500000,"isAtValidTime":true,"subscriptionMethod":"FINANCING","processFee":0,"supportPI":false,"applyFundLimit":3262.57,"threshold":50000000000,"isAvailable":false},{"ipoName":"02249-IPO","ipoId":10428,"financingId":61724,"type":4,"availableFundLimit":3262.57,"piAvailableAmountLimit":0,"piMaxAvailableAmountLimit":-1,"piMinSubscribeAmount":0,"piMaxSubscribeAmount":-1,"minSubscribeLimit":0,"maxSubscribeLimit":-1,"marginRate":100,"interestRate":0,"openTime":1782783000000,"closeTime":1783390500000,"isAtValidTime":true,"subscriptionMethod":"CASH","processFee":0,"supportPI":false,"applyFundLimit":3262.57,"threshold":50000000000,"isAvailable":false}],"financingNotifyEnabled":false,"financingNotifySubscribed":false,"subscriptionMethods":[{"method":"CASH","closeTime":1783390500000,"available":false,"messageCode":"AVAILABLE_FUND_LIMIT","minAvailableFundLimit":3262.57},{"method":"FINANCING","closeTime":1783390500000,"available":false,"messageCode":"AVAILABLE_FUND_LIMIT","minAvailableFundLimit":3262.57}],"latestClosingDate":1783390500000,"subscribedFinanceRatio":4.02,"subscribedRatio":4.02,"forecastRatio":6.76,"raiseMoney":698220000,"totalMargin":2811040000,"quoteInfoUpdatedAt":1783078085185,"prospectusUpdatedAt":1783044519000,"forecastMarketValue":69270083411.55,"minForecastMarketValue":66712760910,"maxForecastMarketValue":71827405913.09999,"sharesOutstanding":2223758697,"business":"公司是一家领先的12英寸纯晶圆代工企业,处于全球半导体价值链的关键环节。作为专业的晶圆代工服务供应商,代工企业将无晶圆、轻晶圆及垂直整合制造(「IDM」)公司的集成电路设计蓝图大规模地制成高品质的加工晶圆。","greyOpeningTime":1783584900000,"greyClosingTime":1783593000000,"tradable":true,"showClawback":true,"clawbackType":"机制B","clawbackRate":10},"@#url:\"stock.company.info\",,undefined,":{"stockCompanyProfile":{},"stockCompanyDetail":{"compareEarnings":[{"period":"1week","weight":-0.0009},{"period":"1month","weight":-0.1146},{"period":"3month","weight":-0.0821},{"period":"6month","weight":-0.1247},{"period":"1year","weight":-0.0482},{"period":"ytd","weight":-0.1005}],"compareStock":{"symbol":"HSI","name":"恒生指数"},"description":"公司前身系合肥晶合集成电路有限公司,2015年5月设立。主要从事12英寸晶圆代工业务,致力于研发及应用行业先进的工艺,为客户提供不同工艺平台、多种制程节点的晶圆代工服务。主要产品为显示驱动芯片(DDIC)、CMOS图像传感器芯片(CIS)、电源管理芯片(PMIC)、微控制器芯片(MCU)、逻辑芯片(Logic)等。","exchange":"SEHK","name":"晶合集成","nameEN":"NEXCHIP"}},"@#url:\"https://hq.skytigris.cn/fundamental/company/manager/list\",params:#symbol:\"02249\",market:\"HK\",,,undefined,":{"directors":[{"name":"蔡国智","position":"董事长,董事,战略与ESG委员会主任委员,战略与ESG委员会委员"},{"name":"陆勤航","position":"副董事长,董事,薪酬与考核委员会委员"},{"name":"陈小蓓","position":"董事,提名委员会委员"},{"name":"郭兆志","position":"董事,审计委员会委员"},{"name":"朱才伟","position":"职工董事,联席公司秘书,授权代表,战略与ESG委员会委员"},{"name":"邱文生","position":"董事,战略与ESG委员会委员"},{"name":"安广实","position":"独立董事,提名委员会委员,审计委员会主任委员,审计委员会委员"},{"name":"蔺智挺","position":"独立董事,薪酬与考核委员会委员,提名委员会主任委员,提名委员会委员"},{"name":"陈铤","position":"独立董事,薪酬与考核委员会主任委员,薪酬与考核委员会委员,审计委员会委员"},{"name":"曹宗野","position":"证券事务代表"},{"name":"叶翠媚","position":"联席公司秘书,授权代表"},{"name":"邱显寰","position":"核心技术人员"},{"name":"张伟墐","position":"核心技术人员"},{"name":"李庆民","position":"核心技术人员"},{"name":"郑志成","position":"核心技术人员"}],"executives":[{"name":"郑志成","position":"联席总经理"},{"name":"邱显寰","position":"联席总经理"},{"name":"蔡国智","position":"代总经理"},{"name":"朱晓娟","position":"副总经理"},{"name":"朱才伟","position":"副总经理,财务负责人,董事会秘书"},{"name":"周义亮","position":"副总经理"}]}}}