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基本半导体
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1
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06/29
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07/03 10:15
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07/07 16:15 - 18:30
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新股消息 | 基本半导体(09971)招股结束 超购约552.29倍 一手入场费约6388港元
智通财经
·
5小时前
基本半导体7月8日登陆港交所,蓝海华腾等A股公司位列股东名单
央广财经
·
7小时前
新股解读|基本半导体(09971):国配“锁筹”缺失或加剧股价波动,产业复苏难解盈利困局
智通财经
·
昨天
新股招股 | 基本半导体今起招股,一手入场费6387.78港元
老虎资讯综合
·
06/29
【新股IPO】基本半导体(099710)今日起招股 入场费6387.78港元
金吾财讯
·
06/29
基本半导体寻求在香港IPO中融资至多8.66亿港元
智通财经
·
06/29
基本半导体(09971)6月29日至7月3日招股 拟全球发售2738.62万股H股
智通财经
·
06/29
新股消息:深圳基本半导体(09971)启动全球发售,发售价区间每股27.49-31.62港元
公告速递
·
06/29
基本半导体通过聆讯,冲击港股碳化硅第一股
华尔街见闻
·
06/23
基本半导体,通过港交所聆讯,或很快香港上市 | TMT企业.IPO上市
港澳IPO上市
·
06/23
碳化硅的AI叙事与价值重估,基本半导体通过港交所聆讯
格隆汇
·
06/22
新股消息 | 基本半导体通过港交所聆讯 专注于第三代功率半导体产业
智通财经
·
06/22
基本半导体通过上市聆讯:年营收3亿亏3.4亿 北京屹唐与广汽智行是股东
雷递
·
06/21
中国首个“碳化硅芯片IPO”要来了
PE星球
·
06/15
新股前瞻|三年累亏7.56亿,基本半导体的“碳化硅故事”还有多少说服力?
智通财经
·
06/08
新股消息 | 基本半导体三度递表港交所 2024年收入在中国碳化硅功率模块市场排名第六
智通财经
·
06/06
基本半导体冲刺港股:年营收3亿亏3亿 北京屹唐与广汽智行是股东
雷递网
·
06/05
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| 基本半导体(09971)招股结束 超购约552.29倍 一手入场费约6388港元","url":"https://stock-news.laohu8.com/highlight/detail?id=2648305655","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648305655?lang=zh_cn&edition=fundamental","pubTime":"2026-07-03 13:52","pubTimestamp":1783057958,"startTime":"0","endTime":"0","summary":"市场统计数据显示,截至6月30日,基本半导体孖展约239.58亿港元,以公开发售4330万港元计,超购约552.29倍。根据发行计划,基本半导体计划发行2738.6万股H股,5%于香港作公开发售,招股价介乎27.49港元至31.62港元,集资最多8.7亿港元,每手200股,一手入场费6387.8港元。基本半导体本次招股未有引入基石投资者。基本半导体成立于2016年,在中国从事碳化硅功率器件的研究、开发、制造及销售。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1462798.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["EWH","IPOS","09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2648658357","title":"基本半导体7月8日登陆港交所,蓝海华腾等A股公司位列股东名单","url":"https://stock-news.laohu8.com/highlight/detail?id=2648658357","media":"央广财经","labels":["shareholding"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648658357?lang=zh_cn&edition=fundamental","pubTime":"2026-07-03 11:34","pubTimestamp":1783049652,"startTime":"0","endTime":"0","summary":"央广网深圳7月3日消息(记者徐锦秀)深圳基本半导体股份有限公司(以下简称“基本半导体”)日前启动H股全球公开发售,预计7月8日正式在香港联交所主板挂牌。本次全球发售2738.62万股H股,发售价区间为每股27.49港元至31.62港元,按上限计算募资总额约8.66亿港元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://finance.eastmoney.com/a/202607033793311472.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_eastmoney","symbols":["BK0014","BK0224","BK0132","399300","09971","300484","159982"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2648575711","title":"新股解读|基本半导体(09971):国配“锁筹”缺失或加剧股价波动,产业复苏难解盈利困局","url":"https://stock-news.laohu8.com/highlight/detail?id=2648575711","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2648575711?lang=zh_cn&edition=fundamental","pubTime":"2026-07-02 11:32","pubTimestamp":1782963146,"startTime":"0","endTime":"0","summary":"有“港股 SiC IDM 芯片第一股”之称的基本半导体于6月29日正式启动招股。按此测算,基本半导体在此次IPO募资总额预计达7.53亿至8.66亿港元。若基本半导体上市后出现破发情形,“绿鞋”将成为维稳公司股价的最后一道“缓冲垫”。所幸,基本半导体在即将上市之际迎来了产业的边际改善窗口。","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1462180.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["09971"],"isVideo":false,"video":null,"gpt_icon":1},{"id":"1188255296","title":"新股招股 | 基本半导体今起招股,一手入场费6387.78港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1188255296","media":"老虎资讯综合","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1188255296?lang=zh_cn&edition=fundamental","pubTime":"2026-06-29 09:00","pubTimestamp":1782694829,"startTime":"0","endTime":"0","summary":"预计2025年至2029年该数值将以47.1%的年复合增长率增长,预计2029年市场规模将达到人民币428亿元。按2024年收入计,公司在中国碳化硅分立器件市场及功率半导体栅极驱动市场的排名分别为第九及第九,市场份额分别为2.7%及1.7%。假设超额配股权未获行使,及假设发售价为每股股份29.56港元,公司估计将收取全球发售所得款项净额约7.125亿港元。","market":"hk","thumbnail":"https://static.tigerbbs.com/26d35a88c8d9d9d46abd395d2bd24396","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/26d35a88c8d9d9d46abd395d2bd24396"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"0","news_top_title":"新股招股 | 基本半导体今起招股,一手入场费6387.78港元","news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647341143","title":"【新股IPO】基本半导体(099710)今日起招股 入场费6387.78港元","url":"https://stock-news.laohu8.com/highlight/detail?id=2647341143","media":"金吾财讯","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2647341143?lang=zh_cn&edition=fundamental","pubTime":"2026-06-29 08:35","pubTimestamp":1782693343,"startTime":"0","endTime":"0","summary":"金吾财讯 | 基本半导体 今日起招股,拟发行2738.62万股H股,其中5%为香港发售,95%为国际发售,另有15%超额配股权。每股发售价介乎27.49港元至31.62港元。每手200股,入场费6387.78港元。股份预期将于7月8日挂牌上市。约20.0%用于在未来五年内对新碳化硅产品的研发工作以及技术创新。","market":"us","thumbnail":"https://static.szfiu.com/news/20220324/ZjY2ZWM0MjU3NTE0MTk1OTA=.jpg","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20220324/ZjY2ZWM0MjU3NTE0MTk1OTA=.jpg"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"1984647","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971","IPOS","EWH"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2647341333","title":"基本半导体寻求在香港IPO中融资至多8.66亿港元","url":"https://stock-news.laohu8.com/highlight/detail?id=2647341333","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2647341333?lang=zh_cn&edition=fundamental","pubTime":"2026-06-29 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于2026年6月29日至2026年7月3日招股,该公司拟全球发售2738.62万股H股,其中香港公开发售占约5%,国际发售占约95%,另有15%超额配股权。每股发售价27.49-31.62港元。集团是中国第三代半导体功率器件行业的企业,专注于碳化硅功率器件的研发、制造及销售。假设超额配股权未获行使,经扣除集团就全球发售应付的承销佣金及其他预计发行费用,及假设发售价为每股股份29.56港元,集团预计将收取全球发售所得款项净额约7.13亿港元。","market":"us","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1460038.html","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"shareholding","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["09971"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1159275418","title":"新股消息:深圳基本半导体(09971)启动全球发售,发售价区间每股27.49-31.62港元","url":"https://stock-news.laohu8.com/highlight/detail?id=1159275418","media":"公告速递","labels":["shareholding","SGX"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1159275418?lang=zh_cn&edition=fundamental","pubTime":"2026-06-29 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6月21日深圳基本半导体股份有限公司日前通过上市聆讯,准备在港交所上市。基本半导体2023年、2024年及2025年分别产生研发开支7580万元、9110万元及1.1亿元。基本半导体2023年、2024年、2025年年内亏损分别为3.42亿元、2.37亿元、3.35亿元;年内亏损率分别为155.1%、79.3%、107.7%。基本半导体2023年、2024年、2025年经调整净亏损分别为3.1亿元、2亿元、2.4亿元。截至2025年12月31日,基本半导体持有的现金及现金等价物为9868万。","market":"sh","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":["earning"],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://mp.weixin.qq.com/s?__biz=MjM5MzQ5NjIyMQ==&mid=2661676126&idx=1&sn=a335509599fb7a8ebb1030c23dcd121e&chksm=bdc779ac8ab0f0ba002fa88dbffbd8554c2c4ef875197b131588582d34cd70cba66dd6128160#rd","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"-1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["09971","159582"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2643075300","title":"中国首个“碳化硅芯片IPO”要来了","url":"https://stock-news.laohu8.com/highlight/detail?id=2643075300","media":"PE星球","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2643075300?lang=zh_cn&edition=fundamental","pubTime":"2026-06-15 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