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Tradr 2X Long SOXX Monthly ETF

22.36

0.0000

成交量：- -

成交额：- -

市值：190.06万

市盈率：- -

高：22.36

开：22.36

低：22.36

收：22.36

52周最高：22.36

52周最低：22.36

股本：8.50万

流通股本：8.50万

量比：- -

换手率：- -

股息：- -

股息率：- -

净资产收益率：--

总资产收益率：--

市净率：--

市盈率(LYR):- -

数据加载中...

总览公司新闻资讯公告

今年主题ETF狂飙近2000亿增长超两成：科创半导体ETF华夏规模增383亿，半导体设备ETF国泰规模增305亿

超170亿元，半导体设备龙头大秀订单！年内这些公司也签下大单

马斯克：台积电不会运营Terafab人工智能芯片综合体

市场消息：TOWA 拟新建半导体设备工厂，完善日本本土供应链。

旧金山联储主席戴利表示，AI热潮带来的芯片需求可能从高端AI芯片扩散至更广泛的半导体市场，部分企业已开始提前锁定存储芯片

据彭博，应用材料公司与英特尔将合作开发人工智能芯片技术。

1400亿元半导体设备龙头，在手订单达170亿元，同比大增88%！

【券商聚焦】富国银行：台积电（TSM）若扩充2纳米产能上游半导体设备商将迎新增长契机

富国银行点评台积电(TSM.US)2nm扩产传闻：半导体设备商或迎增量利好

半导体设备遭遇“估值降速带”? 大摩上调应用材料(AMAT.US)盈利预期但削减目标价

高通正在评估三星电子2nm晶圆代工工艺，并考虑将其应用于下一代移动芯片。

AI热潮重塑晶圆代工格局！瑞银：需求爆发推动先进制程扩产提速成熟制程步入上行周期

AI热潮重塑晶圆代工格局！瑞银：需求爆发推动先进制程扩产提速成熟制程步入上行周期

台积电参股的晶圆代工厂世界先进与欧洲芯片巨头恩智浦合资成立的 VSMC 新加坡首座 12 吋晶圆厂于 9 月 28 日

市场消息：英伟达支持的Firmus公司寻求100亿美元融资，用于开发人工智能芯片。

港股异动 | 澜起科技涨超14% AI智能体Muse点燃CPU行情内存互连芯片需求量有望提升

ETF资金流|资金净流入科创半导体ETF、半导体设备ETF、科创芯片ETF、科创50ETF、沪深300ETF、黄金ETF、金ETF等

中信建投：半导体设备零部件国产化斜率最高方向

传AMD全系列芯片涨价10%！台积电晶圆代工成本走高成主因

韩媒：半导体设备关键零部件交货周期已“延长一倍以上”

华尔街见闻

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...","market":"fut","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tonghuashun_highlight","url":"http://news.10jqka.com.cn/20260930/c680420788.shtml","rn_cache_url":null,"directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://news.10jqka.com.cn/20260930/c680420788.shtml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"tonghuashun_highlight","symbols":["SOXM","THMZ","BK4138","ASMG","INT","WDAI","INYY","TSMG","INTW","LRCC","GINN","TSMX","BCTK","LINT","SOXW","WISE","XITK","LRCU","FRWD","TSMZ","CHPX","TSMU","THNQ","IQM","ALAI","LOUP","QQJG","AIS","SHOC","TSMY","PQNT","AMAU","SMHC","AIO","KSTR","LRNZ","PSAI","ASMZ","TWSC","STSM","XT","XSEM","YNOT","GTEK","INVN","PSCT","APMI","AMA","TEKY","ASMU"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2671212013","title":"【券商聚焦】富国银行：台积电（TSM）若扩充2纳米产能 上游半导体设备商将迎新增长契机","url":"https://stock-news.laohu8.com/highlight/detail?id=2671212013","media":"金吾财讯","labels":["corporation"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2671212013?lang=zh_cn&edition=fundamental","pubTime":"2026-09-29 21:07","pubTimestamp":1790687242,"startTime":"0","endTime":"0","summary":"金吾财讯 | 富国银行发布研究报告指出，芯片代工龙头台积电 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11:51","pubTimestamp":1789703496,"startTime":"0","endTime":"0","summary":"据报道，韩国半导体设备核心零部件全面告急——交货周期普遍翻倍，部分日本制造零部件等待竟长达40个月，溢价也买不到。日本供应商扩产保守、产能严重滞后，压力已向下游传导，三星平泽、SK海力士龙仁等巨额在建项目面临推迟风险，AI芯片扩产计划遭遇供应链\"硬墙\"。","market":"nz","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://wallstreetcn.com/articles/3782048","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["TWSC","PSCT","AIO","SOXM","CHPX","BK4138","SOXW","GINN","LRCU","IQM","INTW","THMZ","XITK","BCTK","SHOC","APMI","STSM","ASMU","ALAI","TSMX","TSMG","WISE","FRWD","WDAI","AMAU","TEKY","AMA","THNQ","TSMU","LRNZ","XT","TSMZ","GTEK","PSAI","LOUP","TSMY","ASMG","ASMZ","XSEM","KSTR","INYY","YNOT","INVN","LINT","QQJG","LRCC","SMHC","PQNT","AIS","INT"],"isVideo":false,"video":null,"gpt_icon":0}],"pageSize":20,"totalPage":10,"pageCount":1,"totalSize":200,"code":"91000000","status":"200"}]}}