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GraniteShares YieldBOOSTTSM ETF

21.05

-0.3125-1.46%

盘后：20.98-0.0740-0.35%16:04 EDT

成交量：4,925

成交额：10.41万

市值：84.22万

市盈率：- -

高：21.56

开：21.56

低：21.05

收：21.37

52周最高：25.39

52周最低：21.05

股本：4.00万

流通股本：4.00万

量比：2.37

换手率：12.31%

股息：7.06

股息率：33.56%

净资产收益率：--

总资产收益率：--

市净率：--

市盈率(LYR):- -

数据加载中...

总览公司新闻资讯公告

高通正在评估三星电子2nm晶圆代工工艺，并考虑将其应用于下一代移动芯片。

AI热潮重塑晶圆代工格局！瑞银：需求爆发推动先进制程扩产提速成熟制程步入上行周期

AI热潮重塑晶圆代工格局！瑞银：需求爆发推动先进制程扩产提速成熟制程步入上行周期

台积电参股的晶圆代工厂世界先进与欧洲芯片巨头恩智浦合资成立的 VSMC 新加坡首座 12 吋晶圆厂于 9 月 28 日

东吴证券：先进制程抬升材料价值量半导体含氟材料加速国产化

传AMD全系列芯片涨价10%！台积电晶圆代工成本走高成主因

时序进入第三季下旬，台积电3nm、2nm先进制程与CoWoS先进封装产能持续供不应求。供应链人士透露，英伟达、苹果等持续

机构：2026年第二季晶圆代工营收接近534.9亿美元先进制程与AI需求持续强劲

机构：2Q26晶圆代工营收接近534.9亿美元，先进制程与AI需求持续强劲

机构：2Q26晶圆代工营收接近534.9亿美元，先进制程与AI需求持续强劲

英特尔晶圆代工与阿斯麦深化合作，推动High-NA EUV用于更大尺寸AI芯片

TradingKey中文

阿斯麦：台积电计划从2030年起将阿斯麦的高数值孔径技术应用于先进制程节点的大规模量产。

机构：第二季度全球纯晶圆代工半导体市场规模同比增长29%

环球市场播报

国家发改委：上半年国内主要晶圆代工企业产能利用率均保持在90%以上

三星：今年先进制程将贡献晶圆代工业务超过一半的收入 SF4生产线一直满负荷运行

三星电子拟将器兴 NRD-K 研发产线改为晶圆代工用途，目标 HBM 用 2nm 基础芯片量产

晶圆代工“双雄”争锋：中芯、华虹二季度利润飙升

先进制程代工供不应求台积电涨超2%

三星晶圆代工 4nm 产能满载至明年，5nm 订单增加拓展AI服务器市场

受益于人工智能芯片需求激增三星电子二季度营业利润创纪录

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