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Tradr 2X Long TSEM Daily ETF

16.87

-0.0764-0.45%

成交量：2,182

成交额：3.76万

市值：101.21万

市盈率：- -

高：17.66

开：17.35

低：16.87

收：16.95

52周最高：26.20

52周最低：10.88

股本：6.00万

流通股本：6.00万

量比：0.37

换手率：3.64%

股息：- -

股息率：- -

净资产收益率：--

总资产收益率：--

市净率：--

市盈率(LYR):- -

数据加载中...

总览公司新闻资讯公告

Tower Semiconductor Ltd(TSEM)股票10月1日盘中上涨7.46%：真相来了

TradingKey中文

高通正在评估三星电子2nm晶圆代工工艺，并考虑将其应用于下一代移动芯片。

AI热潮重塑晶圆代工格局！瑞银：需求爆发推动先进制程扩产提速成熟制程步入上行周期

AI热潮重塑晶圆代工格局！瑞银：需求爆发推动先进制程扩产提速成熟制程步入上行周期

台积电参股的晶圆代工厂世界先进与欧洲芯片巨头恩智浦合资成立的 VSMC 新加坡首座 12 吋晶圆厂于 9 月 28 日

东吴证券：先进制程抬升材料价值量半导体含氟材料加速国产化

芯联集成完成对芯联先进实缴出资布局硅光等高端模拟芯片

传AMD全系列芯片涨价10%！台积电晶圆代工成本走高成主因

巴克莱银行首予Tower半导体“增持”评级，目标价设定为310美元

Tower Semiconductor Ltd(TSEM)股票9月17日盘中上涨8.74%：关键驱动因素揭晓

TradingKey中文

Tower半导体（TSEM）联合New Photonics宣布已规模化出货AI光引擎芯片

英唐智控：签订协议获汽车芯片全球独家授权15年

时序进入第三季下旬，台积电3nm、2nm先进制程与CoWoS先进封装产能持续供不应求。供应链人士透露，英伟达、苹果等持续

芯海科技模拟芯片卖起来了盈利拐点还差什么

大摩回击“AI资本开支见顶论”，预计2028年AI半导体资本开支继续“超车”，2.5D封装产能再增50%

思瑞浦：全系列光通信模拟芯片方案亮相相关方案已完成客户验证

TrendForce：二季度全球前十大晶圆代工厂合计产值接近534.9亿美元再创新高

机构：2026年第二季晶圆代工营收接近534.9亿美元先进制程与AI需求持续强劲

机构：2Q26晶圆代工营收接近534.9亿美元，先进制程与AI需求持续强劲

机构：2Q26晶圆代工营收接近534.9亿美元，先进制程与AI需求持续强劲

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制造成本上升有关。AMD旗下绝大多数芯片均交由台积电代工。而台积电因制造成本持续抬升，已通知客户芯片代工报价上调约10%。","market":"fut","thumbnail":"https://static.tigerbbs.com/a593d85be38c3aa543ab3056553101ff","type":0,"news_type":0,"thumbnails":["https://static.tigerbbs.com/a593d85be38c3aa543ab3056553101ff"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://www.zhitongcaijing.com/content/detail/1498253.html","is_publish_highlight":true,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"stock_zhitongcaijing","symbols":["AMDG","FTXL","AMDC","SOXS","SEMY","CHPY","INT","SOXM","SOXX","TMYY","TSXU","INTW","AMDL","SSG","EMXC","USD","UMCX","SMHC","AMD","TEKX","EWT","CHPX","BGIA","SMHX","AMUU","FLTW","EDZ","SOXY","XSD","159813","CHAT","SMH","PSI","TSEU","IEMG","CHPS","SOXQ","ARMH","TSEG","SHOC"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1114178930","title":"巴克莱银行首予Tower半导体“增持”评级，目标价设定为310美元","url":"https://stock-news.laohu8.com/highlight/detail?id=1114178930","media":"美股速递","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1114178930?lang=zh_cn&edition=fundamental","pubTime":"2026-09-18 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PIC产品基于Tower的PH18DA硅光子平台构建，单通道速率达200G，支持800G至1.6T的数据传输速率。分析指出，随着全球AI算力基础设施爆发式增长，光互连技术的批量应用将成为提升数据中心吞吐效率与降低能耗的关键支柱。","market":"other","thumbnail":"https://static.szfiu.com/news/20250107/ZWU5OWQwM2E0MjY1ODI1NjNmZDJjN2ZmZWQ3OTIxNzAyOTY4MjgwNQ==.png","type":0,"news_type":0,"thumbnails":["https://static.szfiu.com/news/20250107/ZWU5OWQwM2E0MjY1ODI1NjNmZDJjN2ZmZWQ3OTIxNzAyOTY4MjgwNQ==.png"],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"306155","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"productRelease","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["LU1861215975.USD","LU1861220033.SGD","TSEU","IE0009354923.USD","LU2360107168.USD","LAZR","LUMA","LU2098885051.SGD","TSEG","TSEM","LU2290526834.HKD","BK4141","LU1303367103.USD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2668573963","title":"英唐智控：签订协议获汽车芯片全球独家授权15年","url":"https://stock-news.laohu8.com/highlight/detail?id=2668573963","media":"智通财经","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2668573963?lang=zh_cn&edition=fundamental","pubTime":"2026-09-17 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