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三星電子
42.33
0.0000
成交量:
- -
成交額:
- -
市值:
2,851.35億
市盈率:
14.26
高:
42.33
開:
42.33
低:
42.33
收:
42.33
資料載入中...
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新聞
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芯片巨頭,倍感不安
半导体芯闻
·
06-23
三星美國廠,即將量產
半导体芯闻
·
06-23
半導體設備板塊拉昇,中晶科技漲停,中芯國際漲超3%,美擬取消芯片設備豁免
格隆汇
·
06-23
美政府擬取消台積電等在中國使用美國技術豁免
格隆汇
·
06-21
消息稱三星下一代DRAM良率已達50 ~ 70%
爱集微
·
06-20
研報掘金丨國盛證券:京東方A擬收購彩虹光電30%股權,維持“買入”評級
格隆汇
·
06-19
三星電子:谷歌放棄三星轉向臺積電的原因是什麼?
Semi Display
·
06-19
三星電子,實現Chiplet的4nm先進封裝工藝突破
Semi Display
·
06-19
HBM,三星制定新目標
半导体芯闻
·
06-18
BOE入股CHOT影響猜想:或催生電視產業鏈“競合”新平衡
群智咨询
·
06-18
一季度中芯國際營收出爐 iPhone15低至百元感人史無前例
中关村在线
·
06-17
三星Exynos 2600芯片曝光 三星S25跌至白菜價網友搶瘋天
中关村在线
·
06-17
製造難度太大,三星推遲430層NAND Flash量產計劃
芯智讯
·
06-17
三星Exynos 2500將支持衞星通信!預計Z Flip 7首發
手机中国
·
06-17
臺積電和三星電子計劃今年下半年開始大規模生產2納米半導體技術
格隆汇
·
06-17
【產業信息速遞】HBM4,變貴了
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·
06-17
AI重塑存儲市場,三大原廠競爭白熱化
芯财富
·
06-17
三星披露 RGB Micro LED 電視生產進度
Ofweek光电信息网
·
06-17
全球芯片產業格局劇變:2025年競爭態勢與三星危機下的行業洞察
报告大厅
·
06-17
三星芯片,因何落後?
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06-17
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18:24","pubTimestamp":1750674268,"startTime":"0","endTime":"0","summary":"据报道,华盛顿正在考虑撤销允许韩国芯片制造商引进美国芯片设备进行设施升级的豁免,韩国芯片制造商在中国的运营再次面临不确定性。尽管近年来美国加大力度遏制中国半导体行业的增长,但韩国芯片制造商已采取措施降低潜在风险,因此预计短期影响有限。该公司约四分之一的芯片销售额依赖于中国。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250623190716a718a5ff&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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18:24","pubTimestamp":1750674268,"startTime":"0","endTime":"0","summary":"三星电子正在加速美国尖端晶圆代工厂的量产准备工作,继近期重启此前一直拖延的基础设施建设后,据悉已开始为明年初首次引入量产设施做准备。据业界消息人士23日透露,三星电子正在讨论最早于明年1月或2月向美国泰勒代工厂引入2纳米工艺量产设施的计划。然而,三星电子已多次推迟泰勒代工厂的全面竣工和量产线的建立。因此,三星电子目前正积极与潜在客户就2nm工艺的量产进行谈判。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250623190715a718a5f8&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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11:20","pubTimestamp":1750648833,"startTime":"0","endTime":"0","summary":null,"market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":"c106b6c455da852811f4078fe0fe4bd6","theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["SG9999000418.SGD","00981","EWT","SGXZ81163826.USD","003026","688012","588170","TSM","LU2237443978.SGD","688361","BK4585","LU2357125470.USD","03145","688126","562590","LU2458330243.SGD","BK4141","LU2023250504.SGD","BK4548","301095","LU0878004406.USD","SG9999001093.SGD","688120","LU1997245094.SGD","TWmain","688981","601375","BK4527","159982","SMSD.UK","002371","399300","159582","LU2133065610.SGD","LU1023057109.AUD","LU1064131003.USD","LU1989764664.SGD","LU1282649067.USD","BK4170","IE00BQXX3D17.EUR","BK0201","300346","IE00BQXX3F31.USD","LU0143863198.USD","BK0141","SSNLF","LU2289578879.USD","LU0541501648.USD","LU2506951792.HKD"],"gpt_icon":0},{"id":"2545106979","title":"美政府擬取消台積電等在中國使用美國技術豁免","url":"https://stock-news.laohu8.com/highlight/detail?id=2545106979","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2545106979?lang=zh_tw&edition=fundamental","pubTime":"2025-06-21 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~ 70%","url":"https://stock-news.laohu8.com/highlight/detail?id=2544192321","media":"爱集微","labels":["dataReport"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2544192321?lang=zh_tw&edition=fundamental","pubTime":"2025-06-20 11:28","pubTimestamp":1750390086,"startTime":"0","endTime":"0","summary":"据报道,业界6月19日透露,三星电子上个月在第6代10nm 级DRAM晶圆性能测试中,取得了50 ~ 70%的成品率。三星原计划在去年年底开始大规模生产第6代10nm级DRAM,但三星冒着重新设计芯片的风险,尽管可能会推迟一年以上。报道指出,预计此次量产将大大提高三星电子计划年内量产的第6代HBM 的竞争力。HBM4的第6代10nm级DRAM生产设施位于平泽第3工厂。以此次成功量产为基础,三星电子有可能对平泽3号工厂的HBM4工艺进行大规模投资。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025062011284195242aa4&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, .wx-sou","directOrigin":true},"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025062011284195242aa4&s=b","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"1","news_top_title":null,"news_tag":"dataReport","news_rank":0,"length":0,"strategy_id":0,"source":"tencent","symbols":["SSNLF","BK4543","BK4170","DRAM"],"gpt_icon":0},{"id":"2544155534","title":"研報掘金丨國盛證券:京東方A擬收購彩虹光電30%股權,維持“買入”評級","url":"https://stock-news.laohu8.com/highlight/detail?id=2544155534","media":"格隆汇","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2544155534?lang=zh_tw&edition=fundamental","pubTime":"2025-06-19 15:55","pubTimestamp":1750319706,"startTime":"0","endTime":"0","summary":null,"market":"sh","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"zh","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"https://www.gelonghui.com/rss/live/live.xml","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":"live_gelonghui","symbols":["BK0152","LU1781817850.SGD","BK0109","LU1580142542.USD","BK0108","LU1934453819.USD","BK4211","LU1808992512.USD","BK0188","BK4170","LU1508157978.USD","03145","161027","000725","BK5113","LU1979443071.USD","LU1655091616.SGD","600707","BK0010","BK0028","BK0183","LU2663582299.SGD","PB","BK0214","SMSD.UK","BK4543","BK0196","SSNLF"],"gpt_icon":0},{"id":"2544913913","title":"三星電子:谷歌放棄三星轉向臺積電的原因是什麼?","url":"https://stock-news.laohu8.com/highlight/detail?id=2544913913","media":"Semi Display","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2544913913?lang=zh_tw&edition=fundamental","pubTime":"2025-06-19 11:51","pubTimestamp":1750305062,"startTime":"0","endTime":"0","summary":"随着5纳米及以下先进工艺的竞争加剧,三星电子曾被期待与台积电形成双强格局,但双方差距却逐渐扩大。同期,台积电的市场份额从67.1%上升至67.6%。长期以来,三星电子和谷歌在AP领域一直保持合作。据悉,该芯片是以三星电子的AP“Exynos”为蓝本开发的。过去苹果将AP制造从三星电子转移到台积电的原因与此类似。三星电子计划通过连续的管理层诊断和全球战略会议,制定代工反弹的应急计划。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250619121659a711c215&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Display","labels":["productRelease"],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2544139106?lang=zh_tw&edition=fundamental","pubTime":"2025-06-19 11:51","pubTimestamp":1750305062,"startTime":"0","endTime":"0","summary":"Semi Display /三星电子成功开发了采用先进封装技术“chiplet”标准的4纳米超精细工艺。据17日业界消息,三星电子最近在4纳米工艺中,使用“Universal Chiplet Interconnect Express”的半导体原型产品通过了首次性能评估。自去年以来,三星电子一直在进行将UCIe IP优化应用于4纳米工艺的工作。随着三星电子的这一举措,预计超精细工艺中的chiplet竞争将更加激烈,因为台积电和英特尔等竞争对手也在推出并商业化应用了UCIe技术的工艺。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250619121711a4b1cf0e&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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DRAM搭载在HBM4上,并于今年年底开始量产。因此,美国政府根据《芯片法案》,于去年年底决定向三星电子支付47.45亿美元的补贴。然而,三星电子很难对泰勒代工厂进行先发制人的投资。这也是三星电子目前推迟向其第一家泰勒代工厂引进制造设备的原因。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250618182927a4b05bc9&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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17:37","pubTimestamp":1750153046,"startTime":"0","endTime":"0","summary":"中芯国际在一季度依旧是营收第三高的晶圆代工商,他们的营收为22.47亿美元,高于去年四季度的22.07亿美元,环比增长1.8%,是前五大厂商中唯一环比有增长的厂商,所占的份额由去年四季度的5.5%提升到了6%。中芯国际在全球晶圆代工营收中的比重环比增加,三星电子环比下滑,就意味着中芯国际与三星电子在晶圆代工业务营收方面的差距有缩小。在去年四季度,三星电子晶圆代工业务的营收较中芯国际要高10.53亿美元,今年一季度缩小到了6.46亿美元。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061718040597833a79&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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2600的表现,因为这款芯片将是首款采用三星晶圆厂2nm制程的产品,其成功与否将直接关系到三星在先进制程技术领域的地位。为了在市场中分得一杯羹,三星必须确保Exynos 2600在性能、能效和发热控制方面表现优异。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061718030697833a3b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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的量产投资。然而,截至本月,三星电子仍未能敲定V10 NAND Flash 所需的蚀刻等关键制程设备的供应链。这主要归因于高堆叠层数的NAND Flash 产品的市场需求存在不确定性,以及导入全新制程技术所衍生的成本效益问题,这些因素都严重阻碍了投资的步伐。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250617161318a4add73b&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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For Galaxy移动平台。目前三星已改进生产流程,Exynos 2500将优先搭载于Z Flip 7,而Z Flip 7 FE将使用Exynos 2400芯片,Z Fold 7则采用骁龙8 Elite For Galaxy。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN2025061715085797830002&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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Times》,台积电和三星电子都在加紧努力,计划在2025年下半年开始大规模生产2纳米半导体技术。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250617140818951fc271&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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13:58","pubTimestamp":1750139883,"startTime":"0","endTime":"0","summary":"业内人士指出,SK海力士、三星电子等企业难以将增加的HBM成本完全转嫁给客户。不过,尽管I/O数量增加,三星电子HBM4核心裸晶的单位晶圆产出量预计将略有上升。尽管单位晶圆芯片数有所改善,三星的HBM4制造成本仍可能高于竞争对手。因此,业界预测HBM4的12层堆叠产品价格将超过600美元。存储厂商选择通过晶圆代工来生产HBM4基础裸晶,是为了满足HBM不断提升的性能需求。未来,基础裸晶的重要性预计将进一步上升。","market":"us","thumbnail":null,"type":0,"news_type":0,"thumbnails":[],"rights":{"source":"tencent","url":"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250617140513a4ad9fa1&s=b","rn_cache_url":null,"customStyle":"body{padding-top:10px;}#news_title{font-weight:bold;#titleStyle#;}#news_description span{font-size:12px;#descriptionStyle#;}.footer-note{#statement#}","selectors":".mod-LoadTzbdNews, body","filters":".relate-stock, .hot-list, .recom-box, 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