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台積電

162.91
-1.5706-0.95%
成交量:207.15萬
成交額:3.37億
市值:8,449.37億
市盈率:21.47
高:163.59
開:163.41
低:161.75
收:164.48
資料載入中...

公司資料

公司名字:
台積電
交易所:
NYSE
成立時間:
1987
員工人數:
65152
公司地址:
Hsinchu Science Park,No. 8, Li-Hsin Road 6,Hsinchu City,Taiwan
郵編:
300096
傳真:
886 3 563 7000
簡介:
台灣積體電路製造股份有限公司是中國台灣省政府、飛利浦公司和其他私人投資者的合資企業,於1987年2月21日在中國台灣省註冊成立。公司是目前全球半導體行業最大的LED晶圓代工廠。作為一家代工廠,該公司根據客戶自己或第三方的專有集成電路設計,使用其製造工藝為其製造半導體。該公司提供全面的晶圓製造工藝,包括製造CMOS邏輯、混合信號、射頻、嵌入式存儲器、BiCMOS混合信號和其他半導體的工藝。該公司還提供設計、掩模製作、探測、測試和組裝服務。

董事

名稱
職位
魏哲家
董事長兼首席執行官
Rick Cassidy
Senior Vice President, Corporate Strategy Development; Chairman, TSMC Arizona
Chuan Lin
Independent Director
拉斐爾‧萊夫
Independent Director
Lynn L. Elsenhans
Independent Director
麥克‧史賓林特
Independent Director
摩西‧蓋弗瑞洛夫
Independent Director
彼得‧邦菲
Independent Director
Ursula M. Burns
Independent Director
Chin Ching Liu
Director
曾繁城
Director

股東

名稱
職位
魏哲家
董事長兼首席執行官
Cliff Hou
Senior Vice President; Deputy Co-Chief Operating Officer; Chief Information Security
Y.J. Mii
Executive Vice President; Co-Chief Operating Officer
Y.P. Chin
Executive Vice President; Co-Chief Operating Officer
J.K. Lin
Senior Vice President, Corporate Strategy Development
Kevin Zhang
Senior Vice President, Business Development and Global Sales; Deputy Co-Chief Operating
Lora Ho
Senior Vice President, Human Resources
Sylvia Fang
Senior Vice President, Legal; General Counsel; Corporate Governance Officer
Wei Jen Lo
Senior Vice President, Corporate Strategy Development
Wendell Huang
Senior Vice President, Finance; Chief Financial Officer; Spokesperson
Arthur Chuang
Vice President, Operations/ Facility
C. S. Yoo
Vice President, Research & Development/ More-than-Moore Technologies
Chris Horng Dar Lin
Vice President, Corporate Information Technology; Chief Information Officer
Douglas Yu
Vice President, Research & Development/ Pathfinding for System Integration; TSMC
Geoffrey Yeap
Vice President, Research & Development/ Platform Development
Jonathan Lee
Vice President, Corporate Planning Organization
Jun He
Vice President, Operations/ Advanced Packaging Technology and Service
K. C. Hsu
Vice President, Research & Development/ Integrated Interconnect & Packaging
L.C. Tu
Vice President, Research & Development/ Design & Technology Platform; TSMC Fellow
Michael Wu
Vice President, Research & Development/ Platform Development
Min Cao
Vice President, Research & Development/ Pathfinding and Corporate Research
P.H. Chen
Vice President, Human Resources
Ray Chuang
Vice President, Operations/ Fab Operations I; CEO, ESMC
Simon Jang
Vice President, Research & Development/ Advanced Tool and Module Development
T.S. Chang
Vice President, Operations/ Advanced Technology and Mask Engineering; TSMC Fellow
Vanessa Lee
Vice President, Materials Management
Y. L Wang
Vice President, Operations/ Fab Operations I; CEO, TSMC Arizona
Y.H. Liaw
Vice President, Operations/ Fab Operations II; CEO, JASM